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College of Applied Science & Technology

College of Applied Science & Technology

MANUFACTURING & MECHANICAL ENGINEERING TECHNOLOGY

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click to expandclick to closeManian Ramkumar

Manian Ramkumar

Professor
Manufacturing & Mechanical Engineering Technology / Packaging Science, Manufacturing & Mechanical Engineering Technology
College of Applied Science & Technology

2012 Submissions

Published Conference Proceedings

Ramkumar, S. Manian, Mathew Combs, and Satish Kandlikar. "Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead Free Electronics Packaging." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web. *

Ramkumar, Dr. S. Manian, et al. "Evaluation of a Novel Anisotropic Conductive Adhesive Shear under Multiple Tin-Lead and Lead-free Reflow Cycles for Package-on-Package (PoP) Assembly." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web. *

Ramkumar, Dr. S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. SMTA. Orlando, FL: SMTA, 2012. Web. £

Ramkumar, S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Orlando, FL: n.p., 2012. Print.

External Scholarly Fellowships

9/3/2012 - 8/29/2014
     NYS - DEC
     Amount: $308,132 ≠

9/1/2012 - 3/30/2013
     NYS - DOL
     Amount: $49,524 ≠

9/1/2012 - 3/30/2013
     NYS - DOL
     Amount: $42,650 ≠

10/1/2012 - 12/31/2012
     Alstom Transport
     Amount: $15,000 ≠

Journal Editor

Ramkumar, Dr. S. Manian, ed. Transactions on Component, Packaging and Manufacturing Technology. Washington DC: IEEE, 2012. Web. *

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