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Scholarly Works

Martin Anselm
Assistant Professor

2017 Submissions

Published Conference Proceedings

Thomas, Shalomin, Keyla Y. Bastardo, and Martin K. Anselm. "Industry Trends in Photonics Packaging: Passive Fiber and Die Coupling." Proceedings of the Pan Pacific. Ed. Phil Isaacs. Kaui, Hawaii: SMTA, 2017. Web. *

Valooran, Rohit and Martin K. Anselm. "Investigation of the Factors Influencing the Performance of Low Temperature Solder." Proceedings of the SMTAi 2017. Ed. Raiyo Aspandiar. Rosemont, IL: SMTA, 2017. Web. *

Anselm, Martin K. and Reza Ghaffarian. "QFN Reliability, Thermal Shock, Lead-free vs. SnPb, Microstructure." Proceedings of the 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). Ed. Unknown. Orlando, FL: IEEE, 2017. Web. *

Journal Editor

Ramkumar, Dr. Manian, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print. *

Pan, Jianbiao, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print. *

Park, Seungbae, ed. ASME Journal of Electronic Packaging. New York: ASME, 2017. Web. *

Invited Keynote/Presentation

Anselm, Martin K. "Integrated Photonics Packaging Reliability – Assessing Packaging Strategies and Reliability Testing." International Integrated Reliability Workshop. IEEE. Fallen Leaf Lake, CA. 8 Oct. 2017. Conference Presentation.

2016 Submissions

Journal Paper

Sriperumbudur, Sai Srinivas, Dr. Martin K. Anselm, and Michael Meilunas. "Solder Paste Volume Effects on Assembly Yield and Reliability for Bottom Terminated Components." Soldering & Surface Mount Technology. (2016): 1-16. Print. *

Published Conference Proceedings

Palaniappan, Sakthi Cibi Kannammal and Dr. Martin K. Anselm. "A STUDY ON PROCESS, STRENGTH AND MICROSTRUCTURE ANALYSIS OF LOW TEMPERATURE SnBi CONTAINING SOLDER PASTES MIXED WITH." Proceedings of the SMTAi September 2016. Ed. SMTAi. Rosemont, Illinois: SMTAi, 2016. Web. *

Anselm, Dr. Martin K. "Failure Analysis: Lessons Learned." Proceedings of the Hybrid SMT. Ed. Hybrid SMT. Nurnberg, Barvaria, Germany: n.p., 2016. Web.

Anselm, Dr. Martin K. "Failure Analysis: Lessons Learned." Proceedings of the SMTAi. Ed. SMTAi. Rosemont, Illinois: SMTAi, 2016. Web.

Journal Editor

Arfaei, Dr. Babak, ed. JOM Special Issue. USA: n.p., 2016. Print. «

2015 Submissions

Journal Editor

Byko, Maureen, ed. The Journal of The Minerals, Metals & Materials Society (TMS). Warrendale, PA: he Minerals, Metals & Materials Society, 2015. Print. *

2014 Submissions

Published Conference Proceedings

Anselm, Martin Karl. "A.R.E.A. Component Warpage: Issues with Measurement and Standardization." Proceedings of the SMTA, September 29- October 2, Chicago IL. Ed. SMTA. Edina, MN 55424: n.p., 2014. Web.