This course will provide an introductory understanding of the surface mount and mixed technology assembly processes for lead based and lead free electronics packaging. Topics include coverage of PCBs, assembly types, component types, assembly process, assembly materials, identification of defects, and process control. Critical design tips for ease of manufacture and assembly will be introduced throughout the lecture. Tradeoff decisions between different materials and equipment types will also be highlighted. Basic laboratory demonstrations are included.
Who should attend?