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Performance Analysis of Lead Free Solder Alloys (Sn-Ag-Cu & Sn-Ag-Cu-Bi) with lead free surface finish (OSP & Immersion Ag) under thermal shock and thermal aging conditions |
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Thermal Profiling-Effect of peak temperature and Time-Above-Liquidus (TAL) deviation from process window |
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Study of the Impact of Stencil Solvent on SnPb and SAC pastes |
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Study of delamination phenomenon in plastic packages in a lead free processing environment |
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Lead free research compendium |
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Semiautomatic photonic device assembly process development |
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Pad and aperture shape and size characterization for 0201 assembly |
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Solder beading & tombstoning of chip components |
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Area array consortium |
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International stencil consortium |
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Underfill flow modeling for flip chip assembly |
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No-Flow underfill characterization |
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Deep pocket feeder evaluation |
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SMT adhesive dispense characterization
for jetting |
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Reflow process evaluation for modeled 3D
components |
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Flip chip assembly builds |
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High speed stencil printing |
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SMT prototype board assembly and process
development |
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Nickel squeegee evaluation |
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SMI solder paste print study |
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BGA assembly process characterization |
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