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    Advanced Component Packages & Processes -
    An Introduction Including Lead Free Implementation

1-Day Workshop

Course Description

This course will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages. Packages discussed in this course include BGAs, CSPs, Flip Chip, Wafer Level CSPs, COB, TAB, MCMs and Stacked Packages. A thorough comparison of the advantages and disadvantages of each component type, as well as their implementation requirements will be presented. High density interconnection, thermal management requirements and micro-via technology will also be discussed. The course will also cover assembly process details when using these devices in lead based and lead free assembly. Half day equivalent of hands-on education will be provided in the state-of-the-art laboratory using advanced technology PCB assemblies.

Who should attend?

  • People with prior background in SMT
  • Process, Design, Test and Quality Engineers
  • Process and Quality Technicians
  • Marketing, Sales and Purchasing Staff
  • Managers

After completing this course, you will be able to:

  1. Identify various advanced components packages and their nomenclature
  2. Understand what a PCB is and also the need for effective thermal management
  3. Understand the assembly process required and the various parameters that influence the use of advanced component packages
  4. Understand the influence of various materials such as solder paste, adhesives, flux, underfill, encapsulation, etc.
  5. Evaluate equipment requirements for advanced component assembly.

Topical Outline

  1. Introduction
  2. Electronics Packaging & Levels
    • What is electronics packaging?
    • Levels of Electronics Packaging
    • Thermal Management
    • Substrate Properties
  3. Active SMT Components
    • Active Component Types
    • Active Component Configurations
    • Active Component Specifications
    • IC Packaging Trends
    • Package Evolution
    • Factors Influencing the Package Evolution
  4. Ball Grid Array (BGA) Packages
    • Why are BGAs so popular?
    • Manufacture of BGAs
    • BGA Configurations
  5. Plastic BGAs
    • Component Construction & Details
    • Plastic BGA Benefits & Issues
    • Self-Centering of PBGAs
  6. Ceramic BGA (CBGA)
    • Component Construction & Details
    • Ceramic BGA Benefits & Issues
  7. Tape BGA (TBGA)
    • Component Construction & Details
    • Tape BGA Benefits & Issues
  8. Super BGA
    • Component Construction & Details
  9. Dimpled BGA (DBGA)
  10. Chip Scale Packaging (CSP)
    • CSP Types
    • CSP Packages
    • CSP Packaging for Automated Assembly
    • Factors Influencing Increased Interest in CSP Packages
  11. BGA Assembly Process
    • X-Ray Inspection of BGA Assembly
    • Rework & Repair of BGA Assembly
  12. Flip Chip Attach
    • What is flip chip?
    • Flip Chip Attach-Size Advantage
    • Flip Chip Bumping
    • Flip Chip Packaging for Assembly
    • Flip Chip Assembly Process
    • What is Encapsulation?
    • Flip Chip Attach-Benefits
    • Flip Chip Attach-Issues
  13. Wafer Level Packaging & I/O Redistribution
  14. Ceramic Column Grid Array (CCGA)
    • Component Construction & Details
    • CCGA Solder Joint-Thermal-Fatigue-Induced Failure
  15. Chip-On-Board (COB) Technology
    • COB Assembly Process
    • Wire Bonding
    • Wire Bonding Options
    • Glob Top Encapsulation
    • COB-Benefits & Issues
  16. Tape Automated Bonding (TAB)
    • Component Details
    • Assembly Process
    • Benefits & Issues
  17. Multi-Chip-Module (MCM)
    • MCM Constructions
    • Benefits & Issues
  18. Conductive Adhesives