Course Listings                                                                                  

Fundamentals of Surface Mount Technology & Advanced Packaging Process

Days

Min.*

5-Day

5

6

3-Day

3

6

SMT Process Fundamentals for Lead Based and Lead Free Assembly

Days

Min.*

Lecture

2

6

Lab

Advanced Component Packages and Processes

Days

Min.*

Lecture

1

6

Lab

Stencil Printing Process for Solder Paste Application

Days

Min.*

Lecture

1

6

Lab

Reflow Soldering Process

Days

Min.*

Lecture

1

6

Lab

Failures and their Prevention in Lead (Pb) Free Electronic Assemblies

Days

Min.*

Lecture

1

6

Lab

Lead-Free SMT Rework and Repair

Days

Min.*

Lecture

3

6

Lab

SMT / Through-Hole Rework and Repair

Days

Min.*

Lecture

3

6

Lab

IPC-J-STD-001 Worker Proficiency Training (# of days depends on the choice of modules)

Days

Module 1. General Study of All Requirements

1-5

Module 2. Wires and Terminals

Module 3. Through-Hole Components

Module 4. Surface Mount Components

Module 5. Inspection Methodology

IPC-A-610D Certified IPC Specialist Training

Days

Min.*

3

6

IPC-7711 Certified IPC Specialist Training (# of days depends on the choice of modules)

Days

Module 1. Documentation Introduction & Common Procedures

1-5

Module 2. Wire Splicing

Module 3. Through-Hole Components

Module 4. Chip and MELF Removal/Installation

Module 5. SOIC and SOT Procedures

Module 6. J-Lead and QFP Procedures

Module 7. PWB Circuit Repair

Module 8. Laminate Repair

Module 9. Conformal Coating Identification, Removal and Replacement

*Min. # Required

Please contact us for on-site training needs at 585-475-6934 or madast@rit.edu.

Training Cost

For course pricing please contact Mary Ann Donato at 585-475-6934 or madast@rit.edu