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Current Projects

What We're Doing Now

  • Low temperature solder assembly, reliability, and solder microstructural research and development
  • Investigating the Applicability of Auto-Focus Option for Optimal Oven Recipe Selection for Pb-Free Reflow Soldering
  • Forward and Backward Compatibility for Lead Free Assembly
  • Reliability of Lead-Free Surface Mount Assemblies on Polyimide Substrate
  • CUNY-Compact Photonic Explorer
  • Study of tin whisker growth in lead free assembly
  • Investigation of a novel anisotropic conductive adhesive for lead free assembly
  • NSF-Reliability Education and Analysis Laboratory Development