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  Fundamentals of Surface Mount Technology & Advanced
  Packaging

5-Day Training with Hands-on Laboratory

Course Description

This training course is aimed at providing a thorough understanding of Surface Mount Technology (SMT) and advanced packaging principles, practice, processes, equipment and design. This course will also include extensive discussions on process parameters, process characteristics, identifying and correcting defects.  This course will provide the participants with a strong foundation needed for implementing the SMT process and supporting printed circuit board design. The knowledge gained from this training will help companies enhance product development and manufacturing. The course also includes sufficient coverage and comparison of lead-free and a one and a half day equivalent of hands-on training in the laboratory, equipped with state-of-the-art equipment. 

3-Day Training with Hands-on Laboratory

Course Description

This training course is an abbreviated version of the 5-Day training. It is aimed at providing a sufficiently good understanding of Surface Mount Technology (SMT) and advanced packaging principles, practice, processes, equipment and design. This course will also include discussions on process parameters, process characteristics, identifying and correcting defects.  This course will provide the participants with a good foundation needed for implementing the SMT process. The knowledge gained from this training will help companies enhance product development and manufacturing. The course also includes sufficient coverage and comparison of lead-free and a one-day equivalent of hands-on training in the laboratory equipped, with state-of-the-art equipment. 

Who should attend?

  • People with very little or no background in SMT
  • Process, Design, Test and Quality Engineers
  • Process and Quality Technicians
  • Operators

Topical Outline

  1. Electronics Packaging
    • Levels of Packaging
    • Functions of Packaging
    • Electrical Considerations
    • Mechanical Considerations
    • Material Considerations
    • Thermal Considerations and
    • Environmental Considerations
  2. Printed Wiring Board Materials & Fabrication Overview
  3. Through-Hole Technology Overview
    • Components - Definition and Terminology
    • Component Packaging for Automatic Insertion
    • Automated Assembly Line for Through-Hole Technology
    • Axial, Radial and DIP Component Insertion Sequence
    • Variables Affecting Automatic Insertion
    • Wave Soldering
  4. Surface Mount Technology Overview
    • SMT Components Overview
    • Comparison of IMT and SMT Components
    • SMT Assembly Process
    • Types of SMT Assembly
    • Advantages and Disadvantages of SMT
  5. SMT Components (Detailed Discussion of Terminology and Specifications)
    • The contents of this chapter include details of passive, active and advanced technology components (BGA, CSP, Flipchip, etc.)
  6. Stencil Printing
    • Factors affecting the Print Process
    • Stencil - Construction & Terminology
    • Stencil Manufacturing
      • Laser Cut
      • Chem Etch
      • Electroform
    • Solder Paste
      • Types of Solder Paste
      • Terminology - Rheology, Solder Powder, Thixotropic, etc.
        • Flux
        • Types
        • Constituents - Activators, Rosin/Resin, Solvent
      • Tackiness
      • Packaging of Solder Paste
      • Handling and Safety
    • Squeegee Types
    • Solder Paste Printer Types
    • Print Parameters
      • Squeegee Speed
      • Print Stroke
      • Squeegee Pressure
      • Squeegee Downstop
      • Snap-Off
      • Angle of Attack
      • Squeegee Hopover
      • Squeegee Durometer
    • Process Characteristics
      • Print Life
      • Print Definition
      • Paste Height
      • Scooping
      • Bridging
      • Slumping
  7. Adhesive Dispensing
    • Characteristics of Adhesives
    • Application Methods & Factors Effecting Dot Size
      • Pin Transfer
      • Pressure Syringe
      • Screen Printing
      • Positive Displacement
      • Jetting
      • Process Considerations
    • Environmental Considerations
    • Adhesive Classification
    • Common Application Problems
  8. Component Placement
    • Factors Influencing Use of Automated Pick & Place Equipment
    • Packaging of SMT Components for Automated Placement
    • Classification of Placement Machines
      • Entry Level
      • Chip Shooter
      • Flexible-Medium Volume
      • Mass Placement
      • Odd Component
      • In-Line Placement
      • Mass Placement
  9. Soldering of Surface Mount Components
    • Vapor Phase Soldering
      • Advantages & Disadvantages
    • Reflow Soldering
      • Radiant IR
      • Forced Convection
      • Benefits of Nitrogen Over Air
    • Construction of an IR Oven
    • Oven Profiling
    • Causes of Non-Uniform Heating
    • Wave Soldering
      • Process Steps
      • Wave Configurations
      • Concerns & common defects
  10. Cleaning SMT Assemblies
    • Why Clean?
    • Types of Cleaning
      • Solvent
      • Aqueous
      • Semi-Aqueous with Terpene
      • Aqueous with Saponiphied Water
      • Aqueous Cleaning with Deionized Water
    • No Clean
    • Measurement of Cleanliness
  11. Inspection Techniques & defect identification
  12. Post Assembly Testing
    • Types of Testing
      • Manual Testing
      • Populated Substrate Shorts Testing
      • In-Circuit Analyzer
      • In-Circuit Testing
    • ICT Fixturing
    • Fixtureless ICT
    • Functional Testing
    • In-Product Testing
  13. SMT Rework and Repair
    • Why Rework and Repair?
    • Rework and Repair Process
    • Tips for effective rework & repair
    • Materials & Tools Associated with Rework and Repair
    • Parameters Associated with Rework and Repair
    • Process Considerations
    • Environmental Considerations
  14. General Guidelines for Designing with SMT
    • Terminology
    • Land Pattern Design and Solderability
    • Recommended Component Orientation for Wave Soldered Substrates
    • Track and Via Design
    • Routability
    • Manufacturability
    • Electrical Considerations
    • Thermal Considerations
    • Testability
    • Cost Considerations
  15. Automated Optical Inspection (AOI)
    • Sequence of Operation
    • Illumination Techniques
      • Front Lighting
      • Back Lighting
    • Sources of Illumination
    • Optics
    • CCD Camera
      • Pixel Resolution
    • Image Processing Unit
    • Applications in SMT Process
    • Issues