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‘LEAD-FREE RESEARCH COMPENDIUM’ REPORT OUTLINE The compendium is divided into chapters and the outline topics discussed in each chapter is shown below: |
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| Chapter 1: WHY LEAD-FREE? | ||
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Significance of ‘lead’ | |
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Why ban lead from electronics? | |
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Global lead-free implementation status | |
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Lead and lead-free comparison | |
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Process changes required for Surface Mount Technology (SMT) | |
| Chapter 2: SELECTION OF LEAD-FREE SOLDERS | ||
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Desired characteristics of lead-free solder paste | |
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Various lead-free elements | |
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Viable lead-free compositions | |
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Recommended lead-free solder alloys for SMT | |
| Chapter 3: LEAD-FREE SURFACE MOUNT TECHNOLOGY | ||
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Compatibility issues | |
| - PCB surface finish compatibility | ||
| - Component compatibility | ||
| - Flux for lead-free technology | ||
| - Cleaning of lead-free residues | ||
| - Solder Vs PCB finish Vs Component terminal finish Vs Flux | ||
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Lead-free solder paste printing and component placement | |
| - Factors affecting lead-free solder paste printing | ||
| - Rheology of solder paste and its significance in printing | ||
| - Rheology process window for lead-free solder paste | ||
| - Effect of metal content, particle size distribution and flux | ||
| - Process window for lead-free solder paste printing | ||
| - Component placement | ||
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Lead-free soldering | |
| - Wave soldering | ||
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Critical process parameters (includes inert atmosphere) |
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Dross |
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Impact of lead-free solder in wave soldering equipment |
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Energy consumption |
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| - Reflow soldering | ||
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Critical process parameters (includes inert atmosphere) |
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Impact of lead-free solder in reflow equipment |
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Energy consumption |
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| - Rework and repair | ||
| - Inspection | ||
| Chapter 4: LEAD-FREE DEFECTS | ||
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Defects due to lead-free materials | |
| - Lead contamination | ||
| - Black pad | ||
| - Tin whiskers | ||
| - Tin pest | ||
| - Voids | ||
| - Conductive Anodic Filament | ||
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Process related defects | |
| - Fillet lifting | ||
| Chapter 5: RELIABILITY OF LEAD-FREE TECHNOLOGY | ||
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Detailed discussion of lead-free reliability | |
| Chapter 6: ALTERNATIVES TO LEAD-FREE | ||
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Conductive Adhesives | |
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Press fit connections | |
| Chapter 7: IMPLEMENTATION OF LEAD-FREE TECHNOLOGY | ||
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Detailed discussion of steps to successfully implement lead-free technology | |
78 Lomb Memorial Drive Rochester, NY 14623 | Directions | voice: 585-475-6934 | fax: 585-475-7167
