CEMA collaborates with CUNY to provide electronics packaging design, assembly and testing services to support the PCB module requirements for their Compact Photonics Explorer (CPE) project. This includes providing technical assistance to CUNY researchers, assembling the PCBs containing the control electronics and the video-OSC/modulatore/tramsmitter, test PCB assemblies for functionality and supply PCB modules to CUNY.
CEMA and KIC Profiling partner to investigate the applicability of Auto-Focus option software relative to traditional tools for optimal reflow oven recipe selection for PB-free soldering.
CEMA is finally equipped with a state of the art Failure Analysis Capability Laboratory. This includes the recently acquired Two Zone Thermal Shock Chamber and Temperature/Humidity Chamber.
Professor Ramkumar presented a paper at the APEX show in Anaheim, CA in February on Lead Free 0201 Assembly.
CEMA was featured in the January SMT magazine promoting their lead free compendium. Read more about it at:
CEMA is currently developing a ‘Lead-free Research
Compendium’ by compiling information available in research
papers and text books. This compendium will be an excellent reference
tool for companies to educate their employees on lead-free technology.
The report will also help companies in the implementation of lead-free
View our ‘LEAD-FREE
RESEARCH COMPENDIUM’ outline.
CEMA and KIC Thermal Profiling partner on a research project to determine the influence of the deviation in thermal profile above and below the standard thermal process window for lead free soldering.
CEMA collaborated with The Center for Excellence in Lean Enterprise (CELE) to develop a customized Lean Production Training program sponsored by Siemens for the benefit of their customers on an open enrollment basis. The program was held on RIT’s campus within the CEMA facility and included several laboratory exercises.
CEMA has recently acquired a Two Zone Thermal Shock and a Temperature/Humidity Chamber through the NSF/REAL grant, to support the failure analysis capability.
CEMA collaborated with The Center for Excellence in Lean Enterprise (CELE) to develop a customized Lean Production Training program sponsored by Siemens for the benefit of their customers on an open enrollment basis. The program was held on RIT’s campus within the CEMA facility and included several laboratory exercises
The Infotonics Technology Center of Rochester has invested $120,000 in CEMA for the development of its first prototype optoelectronics package - an integrated, low-cost Optical Channel Monitor (OCM). This optoelectronics package will be developed primarily to characterize the packaging materials, substrates, assembly techniques, alignment techniques, inspection and test methods. RIT is offering companies the opportunity to participate.
The Consortium for Optoelectronics Packaging Education
(COPE) grant involves the development of a unique four-course optoelectronics-packaging
curriculum and laboratory, made possible by an award of $250,000
from the Society of Manufacturing Engineers.
RIT and its academic partners Corning Community College
in New York and George Brown College in Ontario, Canada, and industry
Instruments and Lumetrics
have formed the Consortium. The mission of COPE is to develop and
implement the optoelectronics-packaging program that will produce
skilled professionals who can immediately contribute on the job.
The program will provide students with the technical
knowledge industry needs in optics, optical communication, optoelectronics
devices, materials, substrate, assembly process, test, inspection
and reliability. As the field of optoelectronics evolves, COPE will
provide the ideal environment for innovation and collaboration in
technical training and applied research for industry.
Norcross, Georgia, January 26, 2004 - Siemens Dematic
Electronics Assembly Systems (EAS) announced their intention to
provide comprehensive SMT Process training in partnership with the
Center for Electronics Manufacturing & Assembly (CEMA) at Rochester
Institute of Technology, (RIT) Rochester, New York.
The training will take place at RIT’s Center for Electronics
Manufacturing & Assembly facility. This facility has a fully
equipped Surface Mount Technology Laboratory which includes screen
printing, dispensing, pick and place, reflow, rework stations, optoelectronics
workstations, wire bonding, test, and inspection equipment.
Mr. Herbert Hofmann, Director of Services and Operations at Siemens
Dematic EAS stated, “This 5 day intense hands-on course is
aimed at providing participants with a thorough understanding of
Surface Mount Technology and advanced packaging principles needed
for supporting and troubleshooting the SMT process. Additionally,
this course will offer extensive discussions on process parameters
and process characteristics, as well as identifying and correcting
Mr. Hofmann further stated, “Siemens Dematic is known for
its technology leadership. By partnering with RIT we hope to expand
on our advanced assembly technology services by combining our efforts
to provide improved quality, faster product introduction and process
stabilization to our customers.”
RIT was founded in 1829 and is a privately endowed, coeducational
university including eight colleges. Professor S. Manian Ramkumar,
Director of the Center for Electronics Manufacturing & Assembly
at RIT stated, “We are very pleased to offer these advanced
technology courses in partnership with Siemens Dematic. We understand
that these skills are imperative in today’s manufacturing
environment in order to improve the performance and quality of the
To find out more information about this course, contact Siemens
Dematic EAS at 1-888-SMT-HELP or visit our website at www.siplace.com.
Siemens Dematic AG is the world's leading supplier
of logistics and factory automation systems. As a systems integrator,
Siemens Dematic supplies a full range of products and services,
from individual products and systems to complete turnkey facilities
as a general contractor. It consists of four business units: Electronics
Assembly Systems, Distribution and Industry, Airport Logistics,
and Postal Automation. The company, with approximately 10,000 employees
worldwide has a business volume of around 2.6 billion Euro or $3.4
billion dollars. For more information: www.siemens-dematic.us
Siemens AG (NYSE: SI), headquartered in Munich/Germany, is a leading
global electronics and engineering company. It employs 417,000 people
in over 190 countries and reported worldwide sales of more than
$74.2 billion in fiscal 2003 (10/1/02 - 9/30/03). The United States
is Siemens' largest market in the world, with sales of more than
$21 billion in fiscal 2002 and more than 74,000 employees in all
Electronic packaging is focus of NSF funding
RIT’s Center for Electronics Manufacturing and Assembly in
the College of Applied Science and Technology is launching REAL:
The Reliability Education and Analysis Laboratory through a two-year,
$167,525 grant from the National Science Foundation’s Course,
Curriculum and Laboratory Improvement program.
REAL will enhance RIT’s three-course sequence in electronics
packaging by applying reliability theory and failure-analysis concepts
to the workplace and qualifying new products and processes in a
laboratory component of the undergraduate curriculum. Emphasis will
be on moisture sensitivity studies, thermal cycling of assemblies,
and destructive and non-destructive analysis of assemblies. Industry
input will ensure relevance.
The lab will be available for product testing by anyone at RIT,
including students completing senior design projects, says Manian
Ramkumar, CEMA director and principal investigator.
“It’s the first lab of its kind at RIT,” adds
Ramkumar, professor of manufacturing and mechanical engineering
Modeled after an electronics packaging and reliability program at
the University of Maryland, REAL will also support National Technical
Institute for the Deaf students and Project Lead the Way teacher-training
workshops for K-12 educators hosted by RIT’s National Technology
Train-ing Center. The lab is expected to be operational by September
The grant is one of only about 100 proposals to receive funding
from among more than 800 applications submitted.
Earlier this year, CEMA shared a $406,395 grant from NSF’s
Major Research Instrumentation program for optoelectronics-packaging
and microsystems research. The grant was used to create the Centralized
Laboratory for Imaging and Metrology.
In 2001, RIT’s Kate Gleason College of Engineering received
a $200,000 grant from NSF’s Course, Curriculum and Laboratory
Improvement program for the creation of two pilot courses in mechanical