RIT Circuit Board CEMA
Center for Electronics Manufacturing and Assembly
Training Sessions Applied Research Facilities and Equipment Curriculum and Graduates Forms Contact Us
   


 

CEMA collaborates with CUNY on Compact Photonic Explorer Development

CEMA collaborates with CUNY to provide electronics packaging design, assembly and testing services to support the PCB module requirements for their Compact Photonics Explorer (CPE) project. This includes providing technical assistance to CUNY researchers, assembling the PCBs containing the control electronics and the video-OSC/modulatore/tramsmitter, test PCB assemblies for functionality and supply PCB modules to CUNY.

CEMA and KIC Profiling partner to study Auto Focus Recipe Selection Tool

CEMA and KIC Profiling partner to investigate the applicability of Auto-Focus option software relative to traditional tools for optimal reflow oven recipe selection for PB-free soldering.

CEMA is now fully equipped with a state of the art Failure Analysis Capability Laboratory

CEMA is finally equipped with a state of the art Failure Analysis Capability Laboratory. This includes the recently acquired Two Zone Thermal Shock Chamber and Temperature/Humidity Chamber.

CEMA presented at APEX a Lead Free 0201 Assembly Presentation

Professor Ramkumar presented a paper at the APEX show in Anaheim, CA in February on Lead Free 0201 Assembly.

CEMA featured in the January SMT magazine.

CEMA was featured in the January SMT magazine promoting their lead free compendium. Read more about it at:
http://smt.pennnet.com/Articles/Article_Display.cfm?Section=ARTCL&
ARTICLE_ID=245684&VERSION_NUM=2&p=3
.

 Lead Free Compendium Completed

CEMA is currently developing a ‘Lead-free Research Compendium’ by compiling information available in research papers and text books. This compendium will be an excellent reference tool for companies to educate their employees on lead-free technology. The report will also help companies in the implementation of lead-free technology.

View our ‘LEAD-FREE RESEARCH COMPENDIUM’ outline.

CEMA and KIC Profiling parter to study Lead Free Reflow

CEMA and KIC Thermal Profiling partner on a research project to determine the influence of the deviation in thermal profile above and below the standard thermal process window for lead free soldering.

CEMA collaborates with Siemens to offer Lean Manufacturing Training

CEMA collaborated with The Center for Excellence in Lean Enterprise (CELE) to develop a customized Lean Production Training program sponsored by Siemens for the benefit of their customers on an open enrollment basis. The program was held on RIT’s campus within the CEMA facility and included several laboratory exercises.

CEMA Acquires Two Zone Thermal Shock and Temperature/Humidity Chamber

CEMA has recently acquired a Two Zone Thermal Shock and a Temperature/Humidity Chamber through the NSF/REAL grant, to support the failure analysis capability.

CEMA offered Lean Manufacturing in Collaboration with Siemens

CEMA collaborated with The Center for Excellence in Lean Enterprise (CELE) to develop a customized Lean Production Training program sponsored by Siemens for the benefit of their customers on an open enrollment basis. The program was held on RIT’s campus within the CEMA facility and included several laboratory exercises

CEMA partners with ASE Instruments and Infotonics Technology Center to develop an optoelectronics package.

The Infotonics Technology Center of Rochester has invested $120,000 in CEMA for the development of its first prototype optoelectronics package - an integrated, low-cost Optical Channel Monitor (OCM). This optoelectronics package will be developed primarily to characterize the packaging materials, substrates, assembly techniques, alignment techniques, inspection and test methods. RIT is offering companies the opportunity to participate.

CEMA completes the SME-MEP COPE Grant to develop Optoelectronics Packaging curriculum.

The Consortium for Optoelectronics Packaging Education (COPE) grant involves the development of a unique four-course optoelectronics-packaging curriculum and laboratory, made possible by an award of $250,000 from the Society of Manufacturing Engineers.

RIT and its academic partners Corning Community College in New York and George Brown College in Ontario, Canada, and industry partners Burleigh Instruments, Celestica, Siemens Dematic, Universal Instruments, Arlink, METCAL, Glenbrook Technologies, Matec Instruments and Lumetrics have formed the Consortium. The mission of COPE is to develop and implement the optoelectronics-packaging program that will produce skilled professionals who can immediately contribute on the job.

The program will provide students with the technical knowledge industry needs in optics, optical communication, optoelectronics devices, materials, substrate, assembly process, test, inspection and reliability. As the field of optoelectronics evolves, COPE will provide the ideal environment for innovation and collaboration in technical training and applied research for industry.

Siemens Dematic Partners with the Rochester Institute of Technology to Provide Comprehensive SMT Process Training

Norcross, Georgia, January 26, 2004 - Siemens Dematic Electronics Assembly Systems (EAS) announced their intention to provide comprehensive SMT Process training in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at Rochester Institute of Technology, (RIT) Rochester, New York.
The training will take place at RIT’s Center for Electronics Manufacturing & Assembly facility. This facility has a fully equipped Surface Mount Technology Laboratory which includes screen printing, dispensing, pick and place, reflow, rework stations, optoelectronics workstations, wire bonding, test, and inspection equipment.

Mr. Herbert Hofmann, Director of Services and Operations at Siemens Dematic EAS stated, “This 5 day intense hands-on course is aimed at providing participants with a thorough understanding of Surface Mount Technology and advanced packaging principles needed for supporting and troubleshooting the SMT process. Additionally, this course will offer extensive discussions on process parameters and process characteristics, as well as identifying and correcting defects.”

Mr. Hofmann further stated, “Siemens Dematic is known for its technology leadership. By partnering with RIT we hope to expand on our advanced assembly technology services by combining our efforts to provide improved quality, faster product introduction and process stabilization to our customers.”
RIT was founded in 1829 and is a privately endowed, coeducational university including eight colleges. Professor S. Manian Ramkumar, Director of the Center for Electronics Manufacturing & Assembly at RIT stated, “We are very pleased to offer these advanced technology courses in partnership with Siemens Dematic. We understand that these skills are imperative in today’s manufacturing environment in order to improve the performance and quality of the manufacturing process.”

To find out more information about this course, contact Siemens Dematic EAS at 1-888-SMT-HELP or visit our website at www.siplace.com.

Siemens Dematic AG is the world's leading supplier of logistics and factory automation systems. As a systems integrator, Siemens Dematic supplies a full range of products and services, from individual products and systems to complete turnkey facilities as a general contractor. It consists of four business units: Electronics Assembly Systems, Distribution and Industry, Airport Logistics, and Postal Automation. The company, with approximately 10,000 employees worldwide has a business volume of around 2.6 billion Euro or $3.4 billion dollars. For more information: www.siemens-dematic.us

Siemens AG (NYSE: SI), headquartered in Munich/Germany, is a leading global electronics and engineering company. It employs 417,000 people in over 190 countries and reported worldwide sales of more than $74.2 billion in fiscal 2003 (10/1/02 - 9/30/03). The United States is Siemens' largest market in the world, with sales of more than $21 billion in fiscal 2002 and more than 74,000 employees in all 50 states

Grant to enhance CAST program

Electronic packaging is focus of NSF funding

RIT’s Center for Electronics Manufacturing and Assembly in the College of Applied Science and Technology is launching REAL: The Reliability Education and Analysis Laboratory through a two-year, $167,525 grant from the National Science Foundation’s Course, Curriculum and Laboratory Improvement program.

REAL will enhance RIT’s three-course sequence in electronics packaging by applying reliability theory and failure-analysis concepts to the workplace and qualifying new products and processes in a laboratory component of the undergraduate curriculum. Emphasis will be on moisture sensitivity studies, thermal cycling of assemblies, and destructive and non-destructive analysis of assemblies. Industry input will ensure relevance.

The lab will be available for product testing by anyone at RIT, including students completing senior design projects, says Manian Ramkumar, CEMA director and principal investigator.

“It’s the first lab of its kind at RIT,” adds Ramkumar, professor of manufacturing and mechanical engineering technology.

Modeled after an electronics packaging and reliability program at the University of Maryland, REAL will also support National Technical Institute for the Deaf students and Project Lead the Way teacher-training workshops for K-12 educators hosted by RIT’s National Technology Train-ing Center. The lab is expected to be operational by September 2005.

The grant is one of only about 100 proposals to receive funding from among more than 800 applications submitted.

Earlier this year, CEMA shared a $406,395 grant from NSF’s Major Research Instrumentation program for optoelectronics-packaging and microsystems research. The grant was used to create the Centralized Laboratory for Imaging and Metrology.

In 2001, RIT’s Kate Gleason College of Engineering received a $200,000 grant from NSF’s Course, Curriculum and Laboratory Improvement program for the creation of two pilot courses in mechanical engineering.