Thin films: deposition and properties; experimental high energy and particle physics, laser-induced fusion research, particle detectors, electronics, X-ray lithography.

Refereed Publications:

J. B. Ma*, J. Dragon*, W. Van Derveer, A. B. Entenberg, V. Lindberg, M. Anschel, D.-Y. Shih, and P. Lauro, "Use of High Temperature and High Humidity to Test the Adhesion of Sputtered Copper to a Polyimide Surface Modified by an AC Nitrogen Glow Discharge", Journal of Adhesion Science and Technology 9, 487-499 (1995).

Presentations:

Dependence of Stress Morphology and Adhesion on Deposition Conditions for Sputtered Copper Films on Polyimide, A. Entenberg, International Conference on Materials and Process Characterization for VLSI, 1991.

External Support:

Donation of Vibrating Sample Magnetometer, P. Cardegna and A. Entenberg, Xerox Corporation, equipment (~ $50,000), November 1994.

Dependence of Stress and Adhesion on Time, Temperature and Humidity for Sputtered Copper Films on Polymer Substrates, A. Entenberg and V. Lindberg, IBM-Endicott, $25,000, 1991.

Measurement of Thermal Conductivities of Polymer Films with the TC-1000 Thermal Comparator, A. Entenberg, University of Rochester Laboratory for Laser Energetics, $3,000, 1990.

Internal Support:

Magnetic Properties of Nanostructured Materials, A. Entenberg, Dean's Project Initiation Grant, 1995-96.

Study of Magnetic Properties of Nanostructured Materials, A. Entenberg, Dean's Summer Research Fellowship, 1995.

Investigation of Magnetic Nanostructured Materials, A. Entenberg, RIT Professional Development Leave Project at Xerox-Webster, Winter 1994.

Adhesion of Sputtered Copper to Flexible Polyimide Substrates Under Extreme Conditions of Temperature, Humidity and Electric Current, A. Entenberg, RIT College of Science Dean's Summer Research Fellowship, 1990.