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Microelectronic Engineering MS

Program overview

The objective of the master of science degree in microelectronic engineering is to provide an opportunity for students to perform graduate-level research as they prepare for entry into either the semiconductor industry or a doctoral program. The degree requires strong preparation in the area of microelectronics and requires a thesis.

Program outcomes

The program has a number of outcomes for its students:

  • Understand the fundamental scientific principles governing solid-state devices and their incorporation into modern integrated circuits.
  • Understand the relevance of a process or device, either proposed or existing, to current manufacturing practices.
  • Develop in-depth knowledge in existing or emerging areas of the field of microelectronics, such as device engineering, circuit design, lithography, materials and processes, and yield and manufacturing.
  • Apply microelectronic processing techniques to the creation/investigation of new process/device structures.
  • Communicate technical material effectively through oral presentations, written reports, and publications.

Program prerequisites include a bachelor of science degree in engineering (such as electrical or microelectronic engineering), including an introductory course in device physics. Students who do not have these prerequisites can take courses during their first semester of study and still complete the MS degree in two years. Prerequisite courses do not count toward the required graduate courses.

Curriculum

The program consists of nine core courses, two graduate electives, and a thesis. The curriculum has been designed for students who do not have an undergraduate degree in microelectronic engineering. Students who have an undergraduate degree in microelectronic engineering will develop a custom course of study with their graduate adviser.

Thesis

A thesis is normally undertaken once the student has completed all course requirements. Planning for the thesis, however, should begin as early as possible. Generally, full-time students should complete their degree requirements, including thesis defense, within two years (four academic semesters and one summer term).

Microelectronic engineering, MS degree, typical course sequence

CourseSem. Cr. Hrs.
First Year
MCEE-601 Microelectronic Fabrication 3
MCEE-605 Lithographic Materials and Processes 3
MCEE-603 Thin Films 3
MCEE-795 Microelectronics Research Methods 1
MCEE-732 Microelectronic Man. 3
MCEE-602 VLS Process Modeling 3
  Graduate Elective* 3
MCEE-795 Microelectronics Research Methods 1
Second Year
MCEE-704 Physical Modeling of Semiconductor Devices 3
  Graduate Elective* 3
MCEE-790 MS Thesis 6
MCEE-795 Microelectronics Research Methods 1
Total Semester Credit Hours 33

* With adviser approval.

Admission requirements

To be considered for admission to the MS program in microelectronic engineering, candidates must fulfill the following requirements:

  • Hold a baccalaureate degree from an accredited university in engineering or a related field,
  • Submit official transcripts (in English) from all previously completed undergraduate and graduate course work,
  • Have an GPA of 3.0 or higher,
  • Submit scores from the Graduate Record Exam (RIT graduates exempt),
  • Submit two letters of reference from individuals well qualified to judge the candidate's ability for graduate study, and
  • Complete a graduate application.
  • International applicants whose native language is not English must submit scores from the Test of English as a Foreign Language (TOEFL).

Candidates applying with a bachelor's degree in fields outside of electrical and microelectronic engineering may be considered for admission; however, bridge courses may be required to ensure the student is adequately prepared for graduate study.


Career Outcomes

Job Titles

Process Engineer, Device Engineer, Development Engineer, Research Engineer, Equipment Engineer, Principle Engineer Process Integration Engineer, Manufacturing Yield Engineer, Photolithography Engineer

Recent Employers

Analog Devices, ASML, BAE, Eastman Kodak, Fairchild Semiconductor, Freescale, GE, Global Foundries, IBM, Infotonics Technology Center, Intel Corporation, Microchip, Micron Technology, National Semiconductor, Northrop Grumman, Samsung,Texas Instruments, Triquint Semiconductor.


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