Temperature Aware Computing in 3D-ICs
Exhibit Code: GLE-303
Zone: Engineering Park
Location: James E. Gleason Hall (GLE/009) - 3430
Time: All Day
Visitors will learn about the thermal management issues in 3D ICs. The framework we have presented to evaluate system performance and thermal profile of 3D multiprocessor system-on-chip (MPSoC) will give a picture of thermal management issues. They also will learn about the novel-via- placement algorithms, cooling mechanisms, and emerging RRAM caches.
Sundararaman Mohanram, David Brenner, Dhireesha Kudithipudi