Rochester Institute of Technology – Microelectronic Engineering
Integrated Circuit Processing Short Course
Dates
January 13-17, 2014
June 9-13, 2014
Future course dates to be announced: Register
Cost
$1900.00 per person - Includes tuition, text book, course material, and laboratory fees. Note - We reserve the right to cancel courses because of low enrollment.
Course coordinator: Dr. Michael Jackson. Outreach Director, RIT / Microelectronic Engineering
phone (585) 475-2828 (Office)
fax (585) 475-5041
79 Lomb Memorial Drive
Rochester, NY 14623
Objective
The objective of the course is to provide a comprehensive, hands-on educational experience in integrated circuit process engineering. Students will attend lectures that provide an overview of the fabrication of MOS integrated circuits and
Micro-Electro-Mechanical Systems (MEMS). In-depth topics include, semiconductor basics, devices, oxidation, diffusion, ion implantation, thin film deposition, plasma etching, statistical process control, process modeling, photolithography, and process characterization techniques. Tutorials covering
topics such as device physics, computer aided design, and mask making are also included. The students also will participate in a structured laboratory in
which a metal gate PMOS integrated circuit will be fabricated using an i-line
stepper on 150mm wafers. (a complete design, mask making, processing, and testing experience).
Who Should Attend
This course is intended for engineers and managers seeking a better understanding of microelectronics theory and practice. The course is ideal for a chemist, physicist, or an electrical or chemical engineer who is beginning a career in the semiconductor industry, in mask making, equipment or materials and packaging.
Past Participants
More than 1,000 people have taken this course since 1986. They represent most U.S. semiconductor manufacturers and suppliers, as well as
companies from Europe and the Pacific Rim. Researchers, scientists, engineers, equipment technicians, and marketing people with degrees ranging from AAS to Ph.D. have successfully completed this course.
Uniqueness
This course is unique because the participants actually design and fabricate a complete integrated circuit in five days as part of the course.
Facilities
The Center for Microelectronic and Computer Engineering features
more than 15,000 sq. ft. of class 10-100-1000 clean room. Integrated circuit
and mask making equipment worth more than $20 million provides for
state-of-the-art processing of I.C.s. This includes workstations with Mentor
Graphic design tools, Silvaco process simulation tools, Oxidation and Diffusion
Furnaces, Steppers (I-line), Sputtering systems, Ion Implantation, Plasma Etch
and IBM AS/400 Computer network for work-in-progress tracking.
Agenda
First Day (8am – 5pm)
- Device Physics
- Overview of MOS and MEMS Processes
- Lunch
- CAD of Integrated Circuits
- Computer-Aided Layout and Mask making Lab
- MEBES e-Beam Mask making
- Microlithography
Second Day (8am – 5pm)
- Oxide Growth and Diffusion
- PMOS Process Flow
- Lunch
- Oxide Growth and First Mask Lab
- Safety
- Four Point Probe Resistivity
- Diffusion Furnace Operation
- i-line 5X Stepper Operation
- Wafertrack Operation
Third Day (8am – 5pm)
- Chemical Vapor Deposition
- Plasma Etching
- Advanced CMOS Processing
- Lunch
- Diffusion and Second Mask Lab
- Metrology of Thin Films
- Facilities Overview and Tour
Fourth Day (8am – 5pm)
- Metallization
- Ion Implantation
- Lunch
- Metallization and Third Mask Lab
- Sputtering of Aluminum
- In-process Characterization
Fifth Day (8am – 3pm)
- SUPREM Process Modeling
- Circuit Simulation
- Statistical Process Control, TQM, and Six Sigma Manufacturing
- Lunch
- Fourth Mask and Device Test Lab, and packaging overview
- Sinter
- Wafer Probing and test
- Graduation
- Adjourn 3:00PM