Two Hundred to Gather for Microsystems Conference at RIT




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The fastest growing area in electronics assembly—optoelectronics—will be a focus of the 2002 Microsystems Conference on advanced packaging technologies, optoelectronics device fabrication, and optoelectronics packaging, assembly and testing, April 22-25 at Rochester Institute of Technology.

"Advanced packaging and optoelectronics have revolutionized the size, weight and density of today’s electronics," says Dick Clouthier, director of RIT’s Center for Electronic Manufacturing and Assembly.

The conference is expected to draw representatives from 200 companies. Keynote addresses will be delivered by Russell Bessette, executive director of the New York State Office of Science, Technology and Academic Research (NYSTAR), and John Fielding, senior strategic project manager for Nortel Networks.

The conference will conclude with tours of RIT microsystems laboratories and Center for Electronic Manufacturing and Assembly facilities.

Conference sponsors include RIT, the Center for Microelectronics Assembly and Packaging, Cahners Electronics Group, Dow Corning Corp., Empire State Development and NYSTAR.



Media note:
To attend or cover the conference-and tour RIT microsystems labs-contact 475-5697 or e-mail mjsuns@rit.edu. For more information, visit etc.rit.edu/cema.