Registration Opens for 2009 Freescale Rochester Technology Symposium at RIT

Freescale VP Lisa Su keynotes program about next generation embedded technologies

Freescale Semiconductors

Lisa Su, Senior vice president, Freescale Networking Systems Group

Next generation microcontrollers, integrated wireless applications and e-field sensing technologies will be the focus of the 2009 Freescale Rochester Technology Symposium that will take place Nov. 5 at Rochester Institute of Technology's Center for Integrated Manufacturing Systems. The all-day symposium will be held in the Louise M. Slaughter Building on the RIT campus. It will kick off with an opening keynote from Lisa Su, senior vice president and general manager of the Freescale Networking Systems Group.

“RIT is honored to host the annual Freescale Rochester Technology Symposium,” says Ken Hsu, professor of computer engineering and director of the Freescale Embedded Systems Lab at RIT. “This symposium is designed for the embedded system design engineers and managers as well as professors and students in the U.S. Northeast region. We are very grateful that Freescale generously donates the funds and equipment in support of this modern lab for our education and research.”

The annual symposium is open to design engineers, engineering professors and students, third-party tools partners, and executive managers for a one-day, multi-track training seminar on Freescale technologies and system design. Participants can participate in labs and presentations, as well as a trade show highlighting development tools, reference designs, customer products, and student applications and projects.

Su joined Freescale in June 2007 as chief technology officer to lead Freescale’s technology roadmap and global research and development operations. She was named general manager of networking and multimedia in September 2008. Prior to joining Freescale, she was at IBM where she was vice president of the Semiconductor Research and Development Center and responsible for the strategic direction of IBM’s silicon technologies, joint development alliances and semiconductor R&D operations.

Featured technologies at the 2009 symposium will include: Freescale’s next generation multi-core family, 8-to-32-bit capable microcontrollers, integrated wireless connectivity, high performance solutions based on the ARM core, pressure and e-field sensing technologies, and high-power radio frequency technology.


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