RIT microelectronic engineering conference features national and international researchers in integrated photonics manufacturing trends

May 9-10 event highlights invited speakers from King Abdullah University and SUNY Polytechnic Institute




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The 34th annual Microelectronic Engineering Conference features top researchers in nanotechnologies, trends in silicon wafer production and photovoltaics development.

Rochester Institute of Technology will host the 34th annual Microelectronic Engineering Conference featuring top researchers in nanotechnologies, trends in silicon wafer production and photovoltaics development.

The conference, which is free and open to the public, takes place from 8 a.m. to 5 p.m. on Tuesday, May 10, in RIT’s Louise Slaughter Hall, rooms 2210-2240. Registration is required and can be done online.

“This year’s conference features a variety of topics that will be of interest to almost everyone working in the semiconductor manufacturing, photonics, MEMS or photovoltaic industries,” said Robert Pearson, director of the microelectronic engineering program in RIT’s Kate Gleason College of Engineering. Participants will also have the opportunity to learn more about the research, education and workforce development efforts underway at the college.

Invited talks will open the conference in the morning; student research presentations begin at 2 p.m. Invited talks include:

  • Michael Schertzer, RIT assistant professor of mechanical engineering and the 2015 RIT-Texas Instruments Douglass Harvey Faculty Development Awardee, “Direct Current Electro-Wetting Assisted Particle Deposition on Flexible Substrates”
  • Steve Hudelson, director growth operations, 1366 Technologies Inc., “Revolutionary Kerfless Wafer Manufacturing via the Direct Wafer process”
  • Ahmed Alfadhel ’10 (electrical engineering) Computer, Electrical and Mathematical Sciences and Engineering Division, King Abdullah University of Science and Technology, “Magnetic Nano-composite Smart Skin”
  • Jeremiah Hebding ’03, ’08 (microelectronic engineering), Derivatives Integration Engineering, SUNY Polytechnic Institute, “Silicon Photonics Processing Challenges for an Advanced Node Foundry”
  • Ken Nagamatsu ’10 (microelectronic engineering), Northrop Grumman Corp. “Low-temperature Heterojunction Solar Cells and Advanced RF Switches”
  • Andrew Burbine ’13, ’16 (microelectronic engineering), product engineer, Mentor Graphics, “Bayesian Analysis for Photolithographic Models”

Microelectronic engineering undergraduate senior research design projects will be highlighted including:

  • Adam Banees, “MEMS Comb Drive Actuator”
  • Patsy Cadareanu, “Development of a Waveguide Demonstration Platform for Education in Integrated Photonic Manufacturing”
  • Christopher Desmond, “Galvanic Corrosion during CMP”
  • Eric Evangelou, “Contact Resistance Characterization on Gallium Nitride Materials”
  • Sid Grover, “Optimization of Transmission Line Measurement (TLM) Structures for Contact Resistivity Determination”
  • Nicholas Hawkins, “Flash Lamp Annealing for Dopant Transfer and Activation in LTPS”
  • Mattias Herrfurth, “Electrostatically Actuated MEMS Switch”
  • Jacob Kupernik, “Lamellar Directed Self Assembly Using PS-b-PMMA Block Co-polymers”
  • Joe McGlone, “Hafnium Based Ferroelectric Thin Films for FeFET Memory Technology”
  • Ryan Moss, “Direct Write Optical Waveguide Fabrication in organic films using a Heidelberg Laser Writer”
  • Corey Shay, “Sub-Micron Poly Gate Critical Dimensions with i-line Lithography”

An opening reception and dinner takes place at 6 p.m. on May 9 at the RIT Inn & Conference Center for microelectronic engineering faculty, students, alumni and industrial advisory board members. More information about the conference and presentations can be found online or by contacting Pearson via email at robert.pearson@rit.edu.

201605/cleanroom_general.jpg

The 34th annual Microelectronic Engineering Conference features top researchers in nanotechnologies, trends in silicon wafer production and photovoltaics development.