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Center for Electronics Manufacturing & Assembly

Oct 6th, 2011 -- research

Capabilities

CEMA offers a variety of electronics packaging services, including:

• Prototype Board Assembly

• Analytical Evaluation of PCB Assemblies

• Process Evaluation

• Materials Evaluation

• Consultation on Process Implementation

• Applied Research Projects

• Equipment Showcasing, Evaluation, & Testing

Equipment

The Comprehensive SMT and Advanced Packaging Lab at CEMA houses the following equipment, listed by purpose:

Stencil Printing

MPM Ultraprint 2000 Stencil Printer

Dispensing

Asymtek S-820

Placement

Siemens S-27

Siemens F-5

Reflow

Heller 1700 Oven

Thermolyne Oven

Inspection & Analysis

Metcal VPI-1000

Cobra Vision System

Mantis Scope

Glenbrook X-ray

Matec C-SAM

High Power Zoom Stereo Microscope

Die/Bump Shear Tester

Temperature Humidity Cycling Chamber

TSE-11-A Small Two-Zone Thermal Chamber

JEOL T330A Scanning Electron Microscope

ESPEC EHS-211M

Solder Paste Inspection

GSI 8200

Rework

APE Chip Master

PACE & Metcal Rework Stations

Metcal APR-5000

Cleaning

Smartsonic Cleaners & Evaporator

Other

Malcom Visometer

Solderability & Track Tester

Micro-Sectioning Equipment

Selective Solder System KISS-102

Kester Omega Meter

Contacts

For assistance or more information, please contact:

S. Manian Ramkumar, Ph.D., Director

Email: smrmet@rit.edu

Phone: (585) 475-6081