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RIT Semiconductor and Microsystems Fabrication Laboratory

The RIT Semiconductor and Microsystems Fabrication Laboratory (SMFL) was built in 1985 to support the nation’s first ABET accredited undergraduate program in Microelectronic Engineering. The main portion of the facility is 10,000 sq. ft. of class 1000 cleanroom with a bay and chase configuration. Additional laboratory space includes a class 100/10 MEBES E-beam laboratory, a surface analysis laboratory, a chemical-mechanical planarization laboratory, and an electrical characterization laboratory.

Capabilities

The capabilities of the SMFL include:

·         Wafer cleaning, ion implantation and diffusion, and high temperature processing both with conventional tube furnaces and RTP systems.

·         CVD / PECVD deposition capabilities are available for oxides, nitrides, and polysilicon. A variety of vacuum systems are available for sputtering and thermal evaporation of metals and dielectrics.

·         Lithography, including automated coating and development systems combined with a set of three 5:1 steppers with capabilities down to 0.25 microns, as well as 1:1 contact lithography and an electron beam exposure system for direct write of wafers and photo mask production.

·         Plasma etch capabilities for silicon, oxides, nitrides, and metals and provision for a broad variety of wet chemical etch processes as well as copper electroplating and CMP.

·         Complete prototyping of devices and systems with help from the electrical and surface analytical characterization labs, microelectronics layout and computer simulation facilities, and in-house industry-standard electronics packaging capability.

 

Equipment

The specific equipment available in the SMFL is listed below by process area:

Lithography

Canon FP2000I i-line stepper

GCA g-line stepper

Karl Suss MA-150 contact aligner

SVG88 photoresist coat/develop track

SSI photoresist coat/develop track

MEBES-III electron beam lithography/maskmaking system

Exitech 157nm DUV Stepper

Chemical Vapor Deposition

Applied Materials P5000 Delta PECVD TEOS

Applied Materials P5000 Delta PECVD Nitride

ASM 6” LPCVD furnace (nitride/poly)

ASM 6” LPCVD furnace (low-temperature oxide)

ASM 4” LPCVD furnace (nitride/poly)

Thermal Processing

AG410 Rapid Thermal Processor

AG610 Rapid Thermal Processor

Three Bruce BDF-4 4-stack Furnace

Implant

Varian 350D Ion Implant (4” and 6” wafers, B and P implant)

Wet Process

MOS RCA Cleaning Bench

BOE HF Bench

Al wet etch/solvent resist strip bench

Hot Phosphoric acid/KOH etch bench

Ultrasonic cleaning bench

General wet process benches

Etch

Applied Materials P5000 Magnetically Enhanced RIE

Lam Research 4600 aluminum RIE (Cl2/BCl3)

Lam Research 490 Autoetch (nitride/polysilicon)

Drytek QUAD RIE etch (fluorocarbon RIE/carbon PECVD)

Branson 3200 2-chamber downstream asher

Tegal 415 Barrel asher

PVD

CVC 601 3-target batch sputter (DC/pulsed)

PE2400 3-target batch sputter (DC)

PE2400 3-target batch sputter (RF)

CHA electron beam evaporator bell jar

CVC thermal evaporator bell jar

Metrology

Hitachi CD-SEM

AMRAY 1830 LaB6 SEM

Phillips 525 SEM

LEO LaB6 SEM/EDAX

Tencor P-2 Profilometer/Stress meter

Tencor Alpha-Step profilometer

Rudolph IV Ellipsometer

Tencor 364 Surfscan

Leitz optical CD measurement station

Nanometrics spectrophotometer thin-film metrology tools (3)

Automated 4-point prober

Many optical microscopes

PHI 490 Multiprobe Auger/XPS system

CMP / Packaging

Leco AP-600 CMP polisher

Westech 372 CMP polisher

Strasbaugh CMP polisher

High-pressure wafer cleaning system

K&S 775 wafer dicing saw

Tempress wafer dicing saw

Contacts

For assistance or more information, please contact:


Karl Hirschman, Ph.D., Director

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Phone: (585) 475-5130

 

Alan Raisanen, Ph.D., Associate Director

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Phone: (585) 475-4828

 

Thomas Grimsley, Operations Manager

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Phone: (585) 475-2912

 

Scott Blondell, Facilities Manager

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Phone: (585) 475-2171