Current Projects
What We're Doing Now
- Low temperature solder assembly, reliability, and solder microstructural research and development
- Investigating the Applicability of Auto-Focus Option for Optimal Oven Recipe Selection for Pb-Free Reflow Soldering
- Forward and Backward Compatibility for Lead Free Assembly
- Reliability of Lead-Free Surface Mount Assemblies on Polyimide Substrate
- CUNY-Compact Photonic Explorer
- Study of tin whisker growth in lead free assembly
- Investigation of a novel anisotropic conductive adhesive for lead free assembly
- NSF-Reliability Education and Analysis Laboratory Development