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ME - Curriculum

The Master of Engineering degree is awarded upon successful completion of an approved graduate program consisting of a minimum of 30 credit hours. The program consists of a possible transition course, six core courses, two elective courses, two credits of the research methods course and a minimum of 4 credits of internship. Under certain circumstances, a student may be required to complete more than the minimum number of credits. The transition course is in an area other than that in which the BS degree was earned. For example, a chemistry major may be required to take a two-course sequence in circuits and electronics. The core courses are divided into three areas, the first is microfabrication MCEE 601, 602 and 603; the second is microelectronic manufacturing MCEE 732, and the third is lithography materials and processes (MCEE605) and nanolithography systems MCEE 615 (see the typical course schedule listed below). The two elective courses are graduate-level courses in a microelectronics related field. Elective courses may be selected from a list that includes courses such as defect reduction and yield enhancement, semiconductor process and device modeling. See the program director for a more complete list of elective courses.


The Microelectronic sequence (MCEE 601, 602, 603) covers major aspects of integrated circuit manufacturing technology such as oxidation, diffusion, ion implantation, chemical vapor deposition, metallization, plasma etching, etc. These courses emphasize modeling and simulation techniques as well as hands-on laboratory verification of these processes. Students use special software tools for these processes. In the laboratory students design and fabricate silicon MOS integrated circuits. They learn how to utilize most of the semiconductor processing equipment and how to develop and create a process, manufacture and test their own integrated circuits.


The microlithography courses are advanced courses in the chemistry, physics and processing involved in microlithography. Optical lithography will be studied through diffraction, Fourier and image assessment techniques. Scalar diffraction models will be utilized to simulate aerial image formation and influences of imaging parameters. Positive and negative resist systems, as well as processes for IC application, will be studied. Advanced topics will include chemically amplified resists; multiple layer resist systems; phase shift masks, and electron beam, x-ray and deep UV lithography. Laboratory exercises include projection system design, resist materials characterization, process optimization, electron beam lithography and excimer laser lithography.


The manufacturing course include topics such as scheduling, work-in-progress tracking, costing, inventory control, capital budgeting, productivity measures and personnel management. Concepts of quality and statistical process control are introduced to the students. The laboratory for this course is the student-run factory functioning in the department. Important issues that include measurement of yield, defect density, wafer mapping, control charts and other manufacturing measurement tools are introduced to the students in the lecture and laboratory. Computer integrated manufacturing is also studied in detail. Process modeling, simulation, direct control, computer networking, database systems, linking application programs, facility monitoring, expert systems applications for diagnosis and training and robotics are all introduced and supported by laboratory experiences in the integrated circuit factory at RIT. An online (distance delivery) version of this program exists for engineers employed in the semiconductor industry. Please refer to the RIT Part-time/Online Guide for details.

A typical schedule for a Master of Engineering in Microelectronic Manufacturing Engineering

Fall (year 1)

Spring (year 1)

Summer (year 1)

  • MCEE-601 Micro Fab, Lab CORE
  • MCEE-605 (3 cr) Lithography Materials & Processes, Lab CORE
  • MCEE-603 (3 cr) Thin Films, Lab CORE
  • Graduate elective (3 cr)
  • MCEE-795 (1 cr) Seminar/Research
  • MCEE-602 (3 cr) VLSI Process Modeling, Lab CORE
  • MCEE-732 (3 cr) CMOS  Manufacturing I, Lab CORE
  • Graduate Professional Elective (3 cr)
  • Graduate Elective (3 cr)
  • MCEE-795 (1 cr) Seminar/Research
  • Internship (4 cr)


Total of 30 credits: 2 Seminar, 4 internship and 24 course credits (8 courses). Transition courses may be required which do not count towards the degree credits.