Robert Stevens

Robert Stevens

Associate Professor
Kate Gleason College of Engineering
Mechanical Engineering

2019 Submissions

Published Conference Proceedings

Adhikari, Tejan and Robert J. Stevens. "Techno-Economic Analysis of Wireless Community Grid for Rural Communities." Proceedings of the IEEE Global Humanitarian Technology Conference. Ed. IEEE. Seattle, WA: n.p., Web. *

2016 Submissions

Journal Paper

Schrlau, Michael G., Robert J Stevens, and Sara Schley. "Advances in Engineering Education Flipping Core Courses in the Undergraduate Mechanical Engineering Curriculum"¯: Heat Transfer." Advances in Engineering Education 5. 3 (2016): 1-27. Print. *

Published Conference Proceedings

Huselstein, Samantha, Steven J. Weinstein, and Robert J. Stevens. "Prototype and Model of Passive Tropical Fruit Dryer Utilizing a Flexible Transpired Solar Collector." Proceedings of the Global Humanitarian Technology Conference. Ed. IEEE. Seattle, WA: n.p., Web. *

2014 Submissions

Journal Paper

Stevens, Robert J., Steven J. Weinstein, and Karuna S. Koppula. "Theoretical Limits of Thermoelectric Power Generation from Exhaust Gases." Applied Energy 133. 15 (2014): 80-88. Print. *

Pierce, Reginald D. and Robert J. Stevens. "Experimental Comparison of Thermoelectric Module Characterization Methods." Journal of Electronic Materials 44. 6 (2015): 1796-1802. Print. *

2013 Submissions

Journal Paper

Sandoz-Rosada, Emil J., Steven J. Weinstein, and Robert J. Stevens. "On the Thomson Effect in Thermoelectric Power Devices." International Journal of Thermal Sciences 66. (2013): 1-7. Print. *

Published Conference Proceedings

Mahajan, Satchit B., Reginald D. Pierce, and Robert J. Stevens. "Characterizing High Temperature Thermoelectric Modules." Proceedings of the International Mechanical Engineering Congress and Exposition 2013. Ed. ASME. San Diego, CA: ASME, 2013. Print. *

2010 Submissions

Published Article

Sandoz-Rosado, E., and R.J. Stevens. “Robust Finite Element Model for the Design of Thermoelectric Modules.” Journal of Electronic Materials, 39.9 (2010) 1848-1855. Print. *