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Scholarly Works

Manian Ramkumar
Professor

2012 Submissions

Published Conference Proceedings

Ramkumar, S. Manian, Mathew Combs, and Satish Kandlikar. "Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead Free Electronics Packaging." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web. *

Ramkumar, Dr. S. Manian, et al. "Evaluation of a Novel Anisotropic Conductive Adhesive Shear under Multiple Tin-Lead and Lead-free Reflow Cycles for Package-on-Package (PoP) Assembly." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web. *

Ramkumar, Dr. S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. SMTA. Orlando, FL: SMTA, 2012. Web. £

Ramkumar, S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Orlando, FL: n.p., 2012. Print.

External Scholarly Fellowships

9/3/2012 - 8/29/2014
     NYS - DEC
     Amount: $308,132 ≠

9/1/2012 - 3/30/2013
     NYS - DOL
     Amount: $49,524 ≠

9/1/2012 - 3/30/2013
     NYS - DOL
     Amount: $42,650 ≠

10/1/2012 - 12/31/2012
     Alstom Transport
     Amount: $15,000 ≠

Journal Editor

Ramkumar, Dr. S. Manian, ed. Transactions on Component, Packaging and Manufacturing Technology. Washington DC: IEEE, 2012. Web. *

2011 Submissions

External Scholarly Fellowships

7/1/2011 - 12/31/2011
     NASA - Jet Propulsion Laboratory
     Amount: $7,400

6/1/2011 - 6/30/2011
     General Motors
     Amount: $6,000

7/1/2011 - 8/31/2011
     KIC
     Amount: $9,200

3/1/2011 - 3/15/2011
     Vicor Corporation
     Amount: $5,000

6/1/2011 - 6/30/2011
     Carestream Health
     Amount: $5,000

8/1/2011 - 8/31/2011
     Celestica
     Amount: $25,000

Invited Presentations/Keynotes

Ramkumar, S. Manian. "Successful Practices for Online Computing, Engineering, and Technology Courses." 41st ASEE/IEEE Frontiers in Education. ASEE/IEEE. Rushmore Plaza Civic Center, Rapid City, SD. 12-15 Oct. 2011. Conference Presentation.

Ramkumar, S. Manian. "Novel Anisotropic Conductive Adhesive for 3D Stacking and Lead-free PCB Packaging A Review." 61st Electronic Components and Technology Conference. IEEE. Walt Disney World, Lake Buena Vista, FL. 31 May 2011. Conference Presentation.

Ramkumar, S. Manian. "Effect of Stencil Technology on Ultra Fine Pitch Printing." SMTA International Conference Proceedings. SMTA. Fort Worth Convention Center, Fort Worth, TX. 16-20 Oct. 2011. Conference Presentation.

Ramkumar, S. Manian. "Effect of Nano-Coated Stencil on 01005 Printing." IPC APEX. IPC. Mandalay Bay Convention Center, Las Vegas, NV. 12-14 Apr. 2011. Conference Presentation.

Ramkumar, S. Manian. "Influence of Filler Modifications on the Performance of a Novel Anisotropic Conductive Adhesive under Temperature/Humidity Aging." Pan Pacific Microelectronics Symposium. SMTA. Hapuna Prince Hotel, Big Island, HI. 18-20 Jan. 2011. Conference Presentation.

2013 Submissions

Published Conference Proceedings

Ramkumar, S. Manian, et al. "Effect of BGA Re-Balling and its Influence on Ball Shear Strength." Proceedings of the IPC APEX Conference. Ed. IPC. San Diego, CA: n.p., 2013. Print.

Ramkumar, S. Manian and Andrew Daya. "Effect of Mixed Alloy BGA Reballing on Board Level Drop Test Reliability." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Fort Worth, TX: n.p., 2013. Print.

2010 Submissions

Editor (book or journal)

Ramkumar, S. Manian. “Packaging and Assembly of Microlectronic Devices and Systems.” Nanotechnology For Telecommunications. ed. Sohail Anwar. Boca Raton: CRC Press, 2010. 335-371. Print.

Published Article

Dhanasekaran, Rangaraj, Harish Gadepalli, and S. Manian Ramkumar. “Analysis of the Influence of Reflow Profile Parameters on Package on Package (PoP) Component Assembly.” SMTA International Conference Proceedings, 25-28 Oct. 2010. n.p. Print. †≠*