UV/VUV properties of various oxide, nitride, silicide, and intermetallic
thin films and multilayer film stacks for application as attenuated phase
shift mask (APSM) materials, optical AR's, resist ARCs, binary masks
materials have been investigated. Thin films refractive index and extinction
coefficient data was obtained by means of spectroscopic ellipsometry
combined with spectrophotometry.
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Atomistic modeling allows for simulation of various composites based
on the materials we have characterized. An effective media approximation
is used, which assumes structural dimension (grain size, layer thickness,
etc.) is less than 0.1 of minimum wavelength considered.
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Several commercial resists have been optically characterized . Results
of these studies include the n&k data, Cauchy coefficients, and the
ABC parameters (Dill parameters). The extracted Cauchy coefficients are
valid for use at wavelengths of 400 nm to 800 nm.
UV properties of various inorganic solutions such as sulfates, phosphates, and
halides. Refractive index and extinction coefficient data were obtained by means
of deviation angle experiment and spectrophotometry.
ILSim is a compact, multi-beam interference lithography simulator. ILSim
is based on full vector interference theory, which allows for application
at extremely high NA values, such as those projected for use with immersion
Oblique is a lithography simulator that focuses on wave propagation
for very high NA lithography.