PACKAGING SCIENCE
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Changfeng GeDirector of APC Center for Packaging Innovation at RIT
Associate Professor
Packaging Science
College of Engineering Technology
2010 Submissions
Published Article
Ge, Changfeng, and Daniel Goodwin. “Compression Strength Formulas for Bliss Cases and Wrap-around Boxes.” Journal of Applied Packaging Research, 4.3 (2010): 155-167. Print. «
Ge, Changfeng. “Adding Barrier-shrink-film to a PET bottle to improve barrier properties.” Journal of Applied Packaging Research, 4.2 (2010). Print. «
Ge, Changfeng, and Daniel Goodwin. “Application of Experimental Modal Analysis to determine natural frequencies of stacked corrugated boxes.” 17th IAPRI World Conference on Packaging, 12-15 Oct. 2010. n.p. Print. *
Published Book
Ge, Changfeng. Package Structure and Mechanism Design with SolidWorks 2010. Mission, KS: SDC Publications, 2010. Print.
Editor (book or journal)
Changfeng Ge. Journal of Applied Packaging Research. DEStech Publications, Inc., 2010. Print.
Daniel GoodwinProgram Chair of Packaging Science
Professor
Packaging Science
College of Engineering Technology
2010 Submissions
Published Article
Ge, Changfeng and Daniel Goodwin. “Compression Strength Formulas for Bliss Cases and Wrap-around Boxes.” Journal of Applied Packaging Research, 4.3 (2010): 155-167. Print. *
Formal Presentation
Goodwin, Daniel, Changfeng Ge, Thomas Kausch and John Siy. “Application of a Creep Measurement Technique to Predict Time to Failure and Compression Strength of Bliss Cases and Wrap-around Boxes.” BAM/IAPRI Symposium on Packaging Research and Development. Berlin, Germany. 12 May 2010. Presentation.
Ge, Changfeng and Daniel Goodwin. “Application of Experimental Modal Analysis to Determine Natural Frequencies of Stacked Corrugated Boxes.” 17th IAPRI World Conference on Packaging. Tianjin, China. 13 Oct. 2010. Presentation.
Published Book
Goodwin, Daniel and Dennis Young. Protective Packaging for Distribution. Lancaster, PA: DEStech Publications, Inc., 2010. Print.
Karen Proctor
Professor
Packaging Science
College of Engineering Technology
2010 Submissions
Formal Presentation
Proctor, Karen. “Packaging Sustainability and the Need for Pre-Shipment Testing”. Sustainable Packaging Coalition Annual Meeting. 19-21 April 2010. Presentation.
Proctor, Karen. “Packaging Sustainability and the Products You Purchase”. American Society for Engineering Education - St. Lawrence Section Conference. Rochester, NY. 26-27 March 2010. Presentation.
S. Manian RamkumarDirector of Center for Electronics Manufacturing and Assembly
Program Chair of MS-Manufacturing and Mechanical Systems I
Professor
Packaging Science
College of Engineering Technology
2010 Submissions
Published Article
Dhanasekaran, Rangaraj, Harish Gadepalli, and S. Manian Ramkumar. “Analysis of the Influence of Reflow Profile Parameters on Package on Package (PoP) Component Assembly.” SMTA International Conference Proceedings, 25-28 Oct. 2010. n.p. Print. " É *
Editor (book or journal)
Ramkumar, S. Manian. “Packaging and Assembly of Microlectronic Devices and Systems.” Nanotechnology For Telecommunications. ed. Sohail Anwar. Boca Raton: CRC Press, 2010. 335-371. Print.