Martin Anselm

Martin Anselm

Associate Professor
College of Engineering Technology
Manufacturing and Mechanical Engineering Technology

2020 Submissions

Published Conference Proceedings

Fernandez, Raynier E. and Dr. Martin Karl Anselm. "Thermal Reliability of Mixing Bismuth-Containing Solder Paste with Sac Bgas at Low Reflow Temperatures – Part 1." Proceedings of the SMTAi 2020. Ed. Richard Coyle. Minneapolis, MN: SMTA, 2020. Web. *

2019 Submissions

Published Conference Proceedings

Borkes, Tom, Martin Anselm, and Malar Hirudayaraj. "Moving Beyond Paideia – Transforming our High Tech Educational Pipeline into one that Focuses on “Learning for Earning,” as well as “Learning for Learning”." Proceedings of the 2019 ASEE Mid-Atlantic Conference - Fall. Ed. Patti Greenawalt. New York City, New York: n.p., 2019. Web. *

Swanson, Tayler J. and Martin Karl Anselm. "Properties of Mixing Sac Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process." Proceedings of the SMTAi 2019. Ed. Robert Rowland. Chicago, Illinois: SMTA, 2019. Web. *

Kotain, Prithvi, Jeff Schake, and Martin Karl Anselm. "Robustness of High Tension, Standard Tension, and Mesh Mount Solder Paste Stencils." Proceedings of the SMTAi 2019. Ed. Robert Rowland. Chicago, Illinois: SMTA, 2019. Web. *

Johnson, Charmaine, et al. "Attachment Quality and Thermal Fatigue Reliability of a Surface Mount Chip Resistor Assembled With a Low Temperature Solder." Proceedings of the SMTAi 2019. Ed. Robert Rowland. Chicago, Illinois: SMTA, 2019. Web. *

Invited Keynote/Presentation

Anselm, Martin K. "Seeking University Graduate Talent and Collaborators for Industrial Research." SMTAi. SMTA. Chicago, Illinois. 22 Sep. 2019. Conference Presentation.

2018 Submissions

Journal Paper

Su, Quang T., et al. "Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking." ASME Journal of Electronic Packaging 140. 041004-1 (2018): 9. Web. «

Published Conference Proceedings

Murling, Adam, et al. "Practical Implementation of Assembly Processes for Low-Melting Point Solder Pastes." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web. *

Gomez, Priscilla, Tayler Swanson, and Martin K. Anselm. "A Study on The Minimum and Maximum Temperatures of The Reflow Process in SMT Assembly on Paste Containing Bismuth Alloys Combined with Lead-Free Solder Spheres." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web. *

Bastardo, Keyla Y., Tayler Swanson, and Martin K. Anselm. "Experimental Study on The Capability And Performance of A Jet Dispensing Feeder in Components Fastening." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web. *

Journal Editor

Yeritsyan, Hrant, ed. Journal of Electronic Materials. New York: Springer, 2018. Web. *

Invited Keynote/Presentation

Anselm, Martin K. "WIT at RIT” - Women in Technology & Is Photonics Integration in our Future?" SMTAi. SMTA. Chicago, IL. 15 Oct. 2018. Conference Presentation.

2017 Submissions

Published Conference Proceedings

Thomas, Shalomin, Keyla Y. Bastardo, and Martin K. Anselm. "Industry Trends in Photonics Packaging: Passive Fiber and Die Coupling." Proceedings of the Pan Pacific. Ed. Phil Isaacs. Kaui, Hawaii: SMTA, 2017. Web. *

Valooran, Rohit and Martin K. Anselm. "Investigation of the Factors Influencing the Performance of Low Temperature Solder." Proceedings of the SMTAi 2017. Ed. Raiyo Aspandiar. Rosemont, IL: SMTA, 2017. Web. *

Anselm, Martin K. and Reza Ghaffarian. "QFN Reliability, Thermal Shock, Lead-free vs. SnPb, Microstructure." Proceedings of the 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). Ed. Unknown. Orlando, FL: IEEE, 2017. Web. *

Journal Editor

Ramkumar, Dr. Manian, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print. *

Pan, Jianbiao, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print. *

Park, Seungbae, ed. ASME Journal of Electronic Packaging. New York: ASME, 2017. Web. *

Invited Keynote/Presentation

Anselm, Martin K. "Integrated Photonics Packaging Reliability — Assessing Packaging Strategies and Reliability Testing." International Integrated Reliability Workshop. IEEE. Fallen Leaf Lake, CA. 8 Oct. 2017. Conference Presentation.

2016 Submissions

Journal Paper

Sriperumbudur, Sai Srinivas, Dr. Martin K. Anselm, and Michael Meilunas. "Solder Paste Volume Effects on Assembly Yield and Reliability for Bottom Terminated Components." Soldering & Surface Mount Technology. (2016): 1-16. Print. *

Published Conference Proceedings

Palaniappan, Sakthi Cibi Kannammal and Dr. Martin K. Anselm. "A STUDY ON PROCESS, STRENGTH AND MICROSTRUCTURE ANALYSIS OF LOW TEMPERATURE SnBi CONTAINING SOLDER PASTES MIXED WITH." Proceedings of the SMTAi September 2016. Ed. SMTAi. Rosemont, Illinois: SMTAi, 2016. Web. *

Anselm, Dr. Martin K. "Failure Analysis: Lessons Learned." Proceedings of the Hybrid SMT. Ed. Hybrid SMT. Nurnberg, Barvaria, Germany: n.p., 2016. Web.

Anselm, Dr. Martin K. "Failure Analysis: Lessons Learned." Proceedings of the SMTAi. Ed. SMTAi. Rosemont, Illinois: SMTAi, 2016. Web.

Journal Editor

Arfaei, Dr. Babak, ed. JOM Special Issue. USA: n.p., 2016. Print. «

2015 Submissions

Journal Editor

Byko, Maureen, ed. The Journal of The Minerals, Metals & Materials Society (TMS). Warrendale, PA: he Minerals, Metals & Materials Society, 2015. Print. *

2014 Submissions

Published Conference Proceedings

Anselm, Martin Karl. "A.R.E.A. Component Warpage: Issues with Measurement and Standardization." Proceedings of the SMTA, September 29- October 2, Chicago IL. Ed. SMTA. Edina, MN 55424: n.p., 2014. Web.