Tool Set

The RIT Semiconductor Nanofabrication Lab has a complete equipment set for 150mm CMOS processing located in 10,000 sq ft of Class 1000/ISO 6 cleanroom with a bay and chase configuration.  An additional Class 100/10 laboratory, an MOCVD Growth Lab and a variety of test characterization equipment round out the facility's research capabilities.

The lab has tools and capabilities in the following areas:

Chemical Vapor Deposition

• Tystar Nitride and Poly deposition
• Ultratech ALD - deposition of alumina, hafnium oxides

Dicing

• ADT Dicing saw - for silicon and ceramics

Dry Etch

• Trion Phantom II RIE
• Trion Minilok
• Trion Phantom ICP
• Trion Apollo Asher
• LAM 490 Plasma Etcher
• STS ASE Deep Si Etcher
• Plasmatherm ICP Cl Etcher
• Xactix XeF2 Etcher

Epitaxy

• Aixtron, 3x2” Metalorganic Chemical Vapor Deposition (MOCVD).  Visit RIT EPICenter for more details. 

Lithography

• ASML 5000 i-line stepper
• GCA g-line stepper
• Suss MA150 Contact Aligner
• Suss MJB4 Contact Aligner
• SVG Coat and Develop Tracks
• Manual Spin Coaters
• Heidelberg Direct Write System

Metrology

• Tencor P2 Profilometer
• CDE Res Map
• Wyko Dynamic Profilometer
• Woollam VASE Ellipsometer

PECVD

• AME P5000 TEOS Deposition
• TRION PECVD

Physical Vapor Deposition

• CHA Ebeam Evaporation
• CVD Thermal Evaporation
• CHA Flash Evaporator
• CVC 601 Sputter Deposition

Thermal & Implant

• Bruce Furnace tubes
• Tystar Oxidation Tube
• Varian 350D Implanter

Wet Chemical Processing

• MOS RCA WetBench
• Nitride and Hot Phos Wetbench
• Al Etch Bench
• Solvent Strip Wetbench