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Evaluation of Ink Based Printed Electronic Circuit Components

This is an exploratory project to assess the suitability of different ink-substrate combinations for direct-write electronics. The inks will be deposited using direct-write processes, and they will then be photonically cured. Standard assessment techniques will be used to determine properties such as adhesion, conductivity, stiffness, etc. for each ink-substrate combination.

PI: Denis Cormier

  Rochester Institute of Technology
One Lomb Memorial Drive,
Rochester, NY 14623-5603
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