Manufacturing and Mechanical Engineering Technology - 2023 | College of Engineering Technology
Faculty Scholarship 2023
Manufacturing and Mechanical Engineering Technology
To view listing from a different department, select department name from the right.Martin Anselm
Associate Professor
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
2023 Submissions
Journal Paper
Swanson, Tayler J. and Martin K. Anselm. "Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature Process." Journal of SMTA 36. 3 (2023): 25-34. Web. *
Peer Reviewed/Juried Poster Presentation or Conference Paper
Coyle, Richard, et al. "The Thermal Cycling Performance of Hybrid Low Temperature Solder Joints Tested at a High Homologous Temperature." Proceedings of the SMTAI. Ed. Raiyo Aspandiar. Minniapolis, MN: SMTA. ˜
Slater, Zachary and Martin K. Anselm. "Case Study: Analyzing 0402 Capacitor Defects With Stencil Printing Misalignment When Using Water Soluble And No-Clean Solder Pastes: Part 2." Proceedings of the SMTAI. Ed. Raiyo Aspandiar. Minniapolis, MN: SMTA. ˜
Krittika Goyal
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
2023 Submissions
Journal Paper
Todorov, A. R., et al. "Design of a Flexible, Wearable Interdigitated Capacitive Sensor for Monitoring Biomarkers of Atopic Dermatitis." IEEE Sensors Journal. (2023): 1-11. Web. «
Book Chapter
Goyal, K. and S.W. Day. "Factors affecting Wearable Electrode Performance and Development of Biomimetic Skin Phantom." In New Advances in Biosensing. London, UK: Intechopen, 2023. 1-18. Web. «
Michael Medlar
Assistant Professor
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
2023 Submissions
Journal Paper
Medlar, Michael P. and Edward C. Hensel. "Transient Three-Dimensional Thermal Simulation of a Fin Field-Effect Transistor With Electron–Phonon Heat Generation, Three Phonon Scattering, and Drift With Periodic Switching." J of Heat Transfer - Transactions of the ASME 145. 2 (2023): 022501 (4 pages). Web. *
Published Conference Proceedings
Medlar, Michael P. and Edward C. Hensel. "ELECTRON-PHONON INTERACTIONS FOR NANOSCALE ENERGY TRANSPORT SIMULATIONS IN SEMICONDUCTOR DEVICES." Proceedings of the Heat Transfer Summer Conference. Ed. American Society of Mechanical Engineeers. New York, NY: n.p., 2023. Web. *