Martin K. Anselm
Martin K. Anselm
BS, State University College at Geneseo; MS, Clarkson University; Ph.D., Binghamton University
Dr. Martin K. Anselm (Director of the Center for Electronics Manufacturing, RIT). Dr. Anselm holds an undergraduate degree in Physics, a Masters in Mechanical Engineering and a Ph.D. in Materials Science & Engineering. Dr. Anselm's Industrial experience includes twelve years of electronics failure analysis and root cause analysis. He also managed the Universal Instruments AREA Consortium which conducted research in assembly materials, process and reliability of electronic packaging. Dr. Anselm served on the Board of Directors for the Surface Mount Technology Association (SMTA) from 2013-2019.
Dr. Anselm's Ph.D. in Materials Science and Engineering from Binghamton University dissertation was titled, "(Cu,Ni)6Sn5 Intermetallic Formation Kinetics on Electroless Nickel (Ni) When Varying Copper (Cu) Concentration and Reflow Process.” His current second level electronics packaging research foci include; 1. Advanced Manufacturing for electronic miniaturization, 2. Low Temperature lead-free solder alloy process optimization and reliability, 3. Solder joint microstructural evolution in thermomechanical fatigue. Dr. Anselm also supports Photonic Integrated Circuit (PIC) packaging and reliability studies funded through NYS and the DOD. Beyond this academic research, Dr. Anselm has also developed training courses for unemployed and under-employed veterans in the NYS Finger Lakes district. He has secured funding from New York’s Consolidated Funding Application (CFA) to provide veterans with training and certifications in electronics manufacturing. This work has resulted in gainful employment for many veterans in the local electronics manufacturing industry.
In the News
June 27, 2023
RIT Certified offers professional training course for L3Harris technicians
Twelve technical specialists from L3Harris are part of a high-tech workforce development pilot program at Rochester Institute of Technology learning how to build the “brains” inside electronic devices. This first cohort of students is part of the region’s broader economic development initiatives to expand industries such as advanced manufacturing.
November 18, 2022
Chips 101 showcases RIT and Upstate NY skills in computer chip development and manufacturing
Becoming the Silicon Valley of the Northeast may have as much power as the computer chips that will soon be designed and developed in the upstate New York region. The recent Chips 101 event, hosted by RIT on Nov. 16, kept to that premise. More than 50 regional government and corporate representatives learned how computer chips are designed and manufactured—and how universities, government, and workforce development initiatives will contribute to this area.
October 6, 2022
Digital Manufacturing on the College Campus
U.S. Tech features RIT's Center for Electronics Manufacturing and Assembly (CEMA).