S. Manian Ramkumar Headshot

S. Manian Ramkumar

Dean-CET
Dean’s Office
College of Engineering Technology

585-475-6081

S. Manian Ramkumar

Dean-CET
Dean’s Office
College of Engineering Technology

585-475-6081

In the News

  • November 18, 2019

    Two students talk at career fair.

    Learning from Industry: Employers keep RIT’s curriculum forward-looking

    For the last several decades, volunteer groups have played a pivotal role in keeping RIT’s curriculum relevant and current with the latest industry trends. The groups of 10 to 30 leaders from a wide variety of companies come together a few times a year to offer their insights for RIT faculty and staff in nearly every college.

  • May 1, 2019

    Man stands in front of yellow industrial robots.

    S. Manian Ramkumar named dean of RIT’s College of Engineering Technology

    Ramkumar, an RIT alumnus and former faculty member, had been serving as interim dean and was named to the permanent position following a national search. He assumes the permanent dean’s role immediately and said he intends to continue the college’s focus on producing highly talented, applied engineers and applied scientists who will make a difference.

Select Scholarship

Published Conference Proceedings
Ramkumar, S. Manian and Andrew Daya. "Effect of Thermal Shock on Lead Free Alloy Combinations in Package on Package Assemblies." Proceedings of the Surface Mount Technology Association International. Ed. SMTA. Chicago, IL: SMTA, 2014. Print.
Ramkumar, S. Manian, et al. "Effect of BGA Re-Balling and its Influence on Ball Shear Strength." Proceedings of the IPC APEX Conference. Ed. IPC. San Diego, CA: n.p., 2013. Print.
Ramkumar, S. Manian and Andrew Daya. "Effect of Mixed Alloy BGA Reballing on Board Level Drop Test Reliability." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Fort Worth, TX: n.p., 2013. Print.
Ramkumar, S. Manian, Mathew Combs, and Satish Kandlikar. "Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead Free Electronics Packaging." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web.
Ramkumar, Dr. S. Manian, et al. "Evaluation of a Novel Anisotropic Conductive Adhesive Shear under Multiple Tin-Lead and Lead-free Reflow Cycles for Package-on-Package (PoP) Assembly." Proceedings of the ASME International Mechanical Engineering Congress and Exposition. Ed. ASME. Houston, TX: ASME, 2012. Web.
Ramkumar, Dr. S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. SMTA. Orlando, FL: SMTA, 2012. Web.
Ramkumar, S. Manian and Andrew Daya. "Influence of Alloy Combination and PCB Location on Package on Package (PoP) Component Assembly." Proceedings of the SMTA International Conference. Ed. Surface Mount Technology Association. Orlando, FL: n.p., 2012. Print.
External Scholarly Fellowships/National Review Committee
3/26/2013 - 8/31/2015
     Department of Labor/UoR
     Amount: $159,748
9/23/2013 - 11/22/2013
     NASA/Jet Propulsion Laboratory
     Amount: $9,493
9/3/2012 - 8/29/2014
     NYS - DEC
     Amount: $308,132
9/1/2012 - 3/30/2013
     NYS - DOL
     Amount: $49,524
9/1/2012 - 3/30/2013
     NYS - DOL
     Amount: $42,650
10/1/2012 - 12/31/2012
     Alstom Transport
     Amount: $15,000
7/1/2011 - 12/31/2011
     NASA - Jet Propulsion Laboratory
     Amount: $7,400
6/1/2011 - 6/30/2011
     General Motors
     Amount: $6,000
7/1/2011 - 8/31/2011
     KIC
     Amount: $9,200
3/1/2011 - 3/15/2011
     Vicor Corporation
     Amount: $5,000
6/1/2011 - 6/30/2011
     Carestream Health
     Amount: $5,000
8/1/2011 - 8/31/2011
     Celestica
     Amount: $25,000
Journal Editor
Ramkumar, Dr. S. Manian, ed. Transactions on Component, Packaging and Manufacturing Technology. Washington DC: IEEE, 2012. Web.
Invited Keynote/Presentation
Ramkumar, S. Manian. "Successful Practices for Online Computing, Engineering, and Technology Courses." 41st ASEE/IEEE Frontiers in Education. ASEE/IEEE. Rushmore Plaza Civic Center, Rapid City, SD. 12-15 Oct. 2011. Conference Presentation.
Ramkumar, S. Manian. "Novel Anisotropic Conductive Adhesive for 3D Stacking and Lead-free PCB Packaging A Review." 61st Electronic Components and Technology Conference. IEEE. Walt Disney World, Lake Buena Vista, FL. 31 May 2011. Conference Presentation.
Ramkumar, S. Manian. "Effect of Stencil Technology on Ultra Fine Pitch Printing." SMTA International Conference Proceedings. SMTA. Fort Worth Convention Center, Fort Worth, TX. 16-20 Oct. 2011. Conference Presentation.
Ramkumar, S. Manian. "Effect of Nano-Coated Stencil on 01005 Printing." IPC APEX. IPC. Mandalay Bay Convention Center, Las Vegas, NV. 12-14 Apr. 2011. Conference Presentation.
Ramkumar, S. Manian. "Influence of Filler Modifications on the Performance of a Novel Anisotropic Conductive Adhesive under Temperature/Humidity Aging." Pan Pacific Microelectronics Symposium. SMTA. Hapuna Prince Hotel, Big Island, HI. 18-20 Jan. 2011. Conference Presentation.
Editor (book or journal)
Ramkumar, S. Manian. “Packaging and Assembly of Microlectronic Devices and Systems.” Nanotechnology For Telecommunications. ed. Sohail Anwar. Boca Raton: CRC Press, 2010. 335-371. Print.
Published Article
Dhanasekaran,Rangaraj, Harish Gadepalli, and S. Manian Ramkumar. “Analysis of the Influence of Reflow Profile Parameters on Package on Package (PoP) Component Assembly.” SMTA International Conference Proceedings, 25-28 Oct. 2010. n.p. Print. " É *