MANUFACTURING AND MECHANICAL ENGINEERING TECHNOLOGY
To view listing from a different department, select department name from the right.Martin Anselm
Associate Professor
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
2022 Submissions
Published Conference Proceedings
Feng, Xinzhi and Martin K. Anselm. "Case Study: Analyzing 0402 Capacitor Defects with Stencil Printing Misalignment when Using Water Soluble and No-Clean Solder Pastes." Proceedings of the SMTA International 2022. Ed. Richard Coyle. Minneapolis, MN: SMTA, 2022. Web. *
Iturregui-Shelton, Sebastian , et al. "Stencil Cleaning Optimization for Fine-pitch Components." Proceedings of the SMTA International 2022. Ed. Richard Coyle. Minneapolis, MN: SMTA, 2022. Web. *
He, Wenjing, Martin K. Anselm, and Richard Coyle. "Thermal Reliability of Mixing Bismuth-Containing Solder Paste with SAC BGAs At Low Reflow Temperatures - Part III." Proceedings of the SMTA International 2022. Ed. Raiyo Aspandiar. Minneapolis, MN: SMTA, 2022. Web. *
Coyle, Richard, et al. "Thermal Cycling Performance of Hybrid Low Temperature Solder Joints Assembled at Different Peak Reflow Temperatures." Proceedings of the SMTA International 2022. Ed. Raiyo Aspandiar. Minneapolis, MN: SMTA, 2022. Web. *
Coyle, Richard, et al. "Thermal Fatigue of Quad Flat No-Lead and Chip Resistor Solder Joints Assembled with SnPb, SAC305, and SnBi Solders." Proceedings of the SMTA International 2022. Ed. Raiyo Aspandiar. Minneapolis, MN: SMTA, 2022. Web. *
Betsy Dell
Professor
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
2022 Submissions
Journal Paper
Bailey, M. B., et al. "Reimagining Seed Grants for the 21st Century: Individual and Institutional Impacts of a Mini-Grants Program." Advance Journal in press. (2022): n/a. Web. «
Michael Medlar
Assistant Professor
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology
2022 Submissions
Journal Paper
Medlar, Michael P. and Edward C. Hensel. "An Enhanced Statistical Phonon Transport Model for Nanoscale Thermal Transport." J of Heat Transfer - Transactions of the ASME. (2022): 9 pages. Web. «