MANUFACTURING AND MECHANICAL ENGINEERING TECHNOLOGY

To view listing from a different department, select department name from the right.

Martin Anselm

Associate Professor
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology

2021 Submissions

Published Conference Proceedings

Miller, Morgan, et al. "Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Defects." Proceedings of the SMTA International 2021. Ed. Richard Coyle. Minneapolis, MN: n.p., 2021. Web. *

Kempaiah, Sahana Marur, et al. "Thermal Reliability of Mixing Bismuth-Containing Solder Paste with SAC BGAs at Low Reflow Temperatures - Part II." Proceedings of the SMTA International 2021. Ed. Richard Coyle. Minneopolis, MN: SMTA, 2021. Web. *

Coyle, Richard, et al. "The Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Mode of Hybrid Low Temperature Solder Joints." Proceedings of the SMTA International 2021. Ed. Raiyo Aspandiar. Minneapolis, NY: SMTA, 2021. Web. *

View All Submissions

Betsy Dell

Professor
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology

2021 Submissions

Journal Paper

Hegde, Swati, et al. "Investigation of process parameters on the anaerobic digestion of a poly(hydroxyalkonate) film." European Polymer Journal. 148. (2021): 110349. Web. «

Published Conference Proceedings

Dell, Elizabeth, Marcos Esterman, and Carol Marchetti. "Equity and Inclusion Considerations in the Work of Academic Governance." Proceedings of the ASEE Conference for Industry & Education Collaboration (CIEC) Phoenix, AZ, February 8-10, 2022. Ed. ASEE. N/A, N/A: n.p., 2022. Web. «

View All Submissions

Michael Medlar

Assistant Professor
Manufacturing and Mechanical Engineering Technology
College of Engineering Technology

2021 Submissions

Published Conference Proceedings

Medlar, Michael P. and Edward C. Hensel. "Validation of a Physics Based Three Phonon Scattering Algorithm Implemented in the Statistical Phonon Transport Model." Proceedings of the ASME 2020 International Mechanical Engineering Congress and Exposition. Ed. ASME. New York, NY: n.p., 2021. Web. ˜

View All Submissions