Marcos Esterman Headshot

Marcos Esterman

Associate Professor
Department of Industrial and Systems Engineering
Kate Gleason College of Engineering

585-475-6922
Office Location

Marcos Esterman

Associate Professor
Department of Industrial and Systems Engineering
Kate Gleason College of Engineering

Education

BS, MS, Massachusetts Institute of Technology; Ph.D., Stanford University

Bio

Dr. Marcos Esterman received his B.S. and M.S. in Mechanical Engineering from the, Massachusetts Institute of Technology, and his Ph.D. in Mechanical Engineering from Stanford University. His teaching interests are in product and process development, and systems engineering. He teaches students in Multi-Disciplinary Design, the Manufacturing and Management Leadership, and the Masters in Product Development Programs. Dr. Esterman is director of the Printer Research and Image Systems Modeling (PRISM) and the co-director of the Sustainable Print Systems Laboratories, which focus on the modeling of printer and imaging systems to support product architecture and business decisions. His research focuses on structured product development methods, sustainable printing, and print as a manufacturing process.

Prior to joining the RIT faculty, Dr. Esterman worked for Hewlett-Packard’s Imaging and Printing Division in Boise, Idaho. At HP, he held a variety of positions in manufacturing and R&D while concurrently conducting his Ph.D. research. His primary product focus was the Color LaserJet products and he supported the development teams that delivered the Color LaserJet 8500 and 9500 printers. His analysis work at HP enhanced design and product architecture decision-making. Marcos also worked as an x-ray tube development engineer at General Electric Medical Systems in Milwaukee, Wisconsin, and he was a graduate of their Edison Engineering Training Program.

Recent Publications

Esterman Jr., M., Fumagalli, M. E., Thorn, B., Babbitt, C. A Framework for the Integration of System Engineering and Functional Analysis Techniques to the Goal and Scope of Life Cycle Assessment, Proceedings of IDETC ‘12: ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conferences, August 12-15, 2012, Chicago, IL, USA. DFMLC BEST PAPER AWARD

Bousquin, J., Gambeta, E., Esterman Jr., M., Rothenberg, S., Life Cycle Assessment in the Print Industry: A Critical Review, Journal of Industrial Ecology: Special Issue: Meta-Analysis of Life Cycle Assessment, Volume 16, Issue Supplemental s1, pp. s195 – s205, April, 2012.

M. Esterman and K. Ishii, The Development of Project Risk Metrics For Robust Concurrent Product Development Across The Supply Chain, Concurrent Engineering: Research & Applications, Volume 13, No.2, pp. 85-94, June 2005.

585-475-6922

Currently Teaching

ISEE-771
3 Credits
The engineering of a system is focused on the identification of value and the value chain, requirements management and engineering, understanding the limitations of current systems, the development of the overall concept, and continually improving the robustness of the defined solution. EOS I & II is a 2-semester course sequence focused on the creation of systems that generate value for both the customer and the enterprise. Through systematic analysis and synthesis methods, novel solutions to problems are proposed and selected. This first course in the sequence focuses on the definition of the system requirements by systematic analysis of the existing problems, issues and solutions, to create an improved vision for a new system. Based on this new vision, new high-level solutions will be identified and selected for (hypothetical) further development. The focus is to learn systems engineering through a focus on an actual artifact
ISEE-599
0 - 4 Credits
A supervised investigation within an industrial engineering area of student interest. Professional elective.
ISEE-772
3 Credits
The engineering of a system is focused on the identification of value and the value chain, requirements management and engineering, understanding the limitations of current systems, the development of the overall concept, and continually improving the robustness of the defined solution. EOS I & II is a 2-semester course sequence focused on the creation of systems that create value for both the customer and the enterprise. Through systematic analysis and synthesis methods, novel solutions to problems are proposed and selected. This second course in the sequence revisits the first sequence and views the engineering of a system through a lean perspective, as such the emphasis is on the system development process itself.
ISEE-799
1 - 3 Credits
This course is used by students who plan to study a topic on an independent study basis. The student must obtain the permission of the appropriate faculty member before registering for the course. Students registering for more than four credit hours must obtain the approval of both the department head and the adviser.
MTSE-777
1 - 4 Credits
This course is a capstone project using research facilities available inside or outside of RIT.

In the News

  • April 1, 2019

    Head-and-shoulders view of man wearing purple button-up shirt.

    Making a social impact with technology

    Associate Professor Marcos Esterman and several RIT senior engineering students are on a mission to empower citizens of Cali, Colombia, through cutting-edge technology including solar-powered 3D printers and aquaponics.

Select Scholarship

Published Conference Proceedings
Takai, Shun and Marcos Esterman. "A Conceptual Framework and a Research Roadmap Towards Enhancing Team Working in Engineering Education." Proceedings of the Proc. ASME. IDETC-CIE2019, Volume 3: 21st International Conference on Advanced Vehicle Technologies; 16th International Conference on Design Education. Ed. ASME. Anaheim, CA: n.p., 2019. Print.
Godbole, Hrushikesh, et al. "Successes and Challenges in Implementing Lean Product Development." Proceedings of the Proc. ASME. IDETC-CIE2019, Volume 3: 21st International Conference on Advanced Vehicle Technologies; 16th International Conference on Design Education. Ed. ASME. Anaheim, CA: n.p., 2019. Print.
Esterman, Marcos, et al. "Integrating Lean Principles for the Management of Product Development." Proceedings of the 2018 IISE Engineering Lean and Six Sigma Conference. Ed. IISE. Atlanta, GA: IISE, Web.
Deo, Devdatta, Marcos Esterman, and Brian Thorn. "A Methodology to Quantify Cumulative Damage Function (CuDF) for Integration Into an Object-Oriented Life Cycle Assessment (LCA)." Proceedings of the Proceedings of IDETC ‘17: ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conferences. Ed. ASME. Cleveland, OH: ASME, 2017. Web.
Gadre, Shantanu, Marcos Esterman, and Brian Thorn. "Implementation of an Object-Oriented Life Cycle Assessment Framework Using Functional Analysis and Systems Engineering Principles." Proceedings of the Proceedings of IDETC ‘17: ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conferences. Ed. ASME. Cleveland, OH: ASME, 2017. Web.
Gruszewski, Richard, et al. "Uncovering Hidden Costs in R&D Outsourcing: A Case Study." Proceedings of the Proceedings of IDETC ‘17: ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conferences. Ed. ASME. Cleveland, OH: ASME, 2017. Web.
Takai, Shun and Marcos Esterman. "Towards a Better Design Team Formation: A Review of Team Effectiveness Models and Possible Measurements of Design-Team Inputs, Processes, and Outputs." Proceedings of the Proceedings of IDETC ‘17: ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conferences. Ed. ASME. Cleveland, OH: ASME, 2017. Web.
Takai, Shun, Michael Wagner, and Marcos Esterman. "A Pilot Study of Cognitive-Neuroscience Mechanism in Product Concept Evaluation." Proceedings of the ASME 2015 International Mechanical Engineering Congress and Exposition,. Ed. ASME. Houston, TX: ASME, 2015. Print.
Santucci, Alissa and Marcos Esterman. "Environmental Impact Assessment During Product Development: A Functional Analysis Based Approach to Life Cycle Assessments." Proceedings of the ASME 2015 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Ed. ASME. Boston, MA: ASME, 2015. Print.
Sundar, Sivakumar, et al. "Warranty Prediction During Product Development: Developing an Event Generation Engine." Proceedings of the IDETC '13: ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conferences. Ed. ASME. Portland, OR: n.p., 2013. Print.
Esterman, Marcos, et al. "A Framework for the Integration of System Engineering and Functional Analysis Techniques to the Goal and Scope of Life Cycle Assessment." Proceedings of the ASME 2012 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference. IL, Chicago: n.p., 2012. Print.
Gambeta, Eni, Marcos Esterman, and Sandra Rothenberg. "Exploring Existing Measures of the Environmental Impacts of Print: A Survey of Existing Practices." Proceedings of the NIP 27: International Conference on Digital Printing Technologies. October 2-6 2011. Minneapolis, MN USA. Ed. Society for Imaging Science and Technology. Springfield, VA: n.p., Print.
Brown, Travis, et al. "Challenges for Managing Component Obsolescence in Low Volume Products Through The Product Development Lifecycle." Proceedings of the ASME 2011: ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conferences, August 29-31, 2011, Washington, DC, USA. Ed. ASME. New York: n.p., Print.
Jorgensen, Jens, et al. "Identifying Enablers and Barriers to Successful Platform-Based Product Development: A Case Study From Business-To-Business Products." Proceedings of the ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conferences, August 29-31, 2011, Washington, DC, USA. Ed. ASME. New York: n.p., Print.
Journal Paper
Esterman, Marcos, et al. "Toward Robust Concurrent Product Development across the Supply Chain: a Risk Assessment Framework." Journal of Engineering Design 31. 3 (2020): 150-177. Web.
Takai, Shun and Marcos Esterman. "A Review of Team Effectiveness Models and Possible Instruments for Measuring Design-Team Inputs, Processes, and Outputs." International Journal of Engineering Education 35. 6(A) (2019): 1684-1697. Print.
Takai, Shun, Marcos Esterman, and Ashok Midha. "An Approach to Study Associations Between Design Concepts and Design Outcomes." Journal of Mechanical Design 137. 4 (2015): 1-12. Print.
Arciniegas, Alvaro J. Rojas, Marcos Esterman, and Juan C. Cockburn. "Toward the Control of the EP3D Printed Surface." Journal of Manufacturing Science and Engineering 137. 2 (2015): 1-10. Print.
Chang, Shu, et al. "Direct Visualization and Three-Dimensional Reconstruction of Structures Formed by Electrophotographic Toner Powder Technology." Powder Technology 269. January (2015): 1-6. Print.
Rojas-Arciniegas, Alvaro Jose and Marcos Esterman. "Characterization and Modeling of Surface Defects in EP3D Printing." Rapid Prototyping Journal 21. 4 (2015): 402-411. Print.
Arciniegas, Alvaro J. Rojas and Marcos Esterman. "Exploring Surface Defects on EP-based 3D Printed Structures." Journal of Imaging Science and Technology 58. 2 (2014): 1-12. Print.
Bousquin, J, et al. "Life Cycle Assessment in the Print Industry:A Critical Review." Journal of Industrial Ecology: Special Issue: Meta-Analysis of Life Cycle Assessment 16. s1 (2012): s195-s205. Print.
Published Article
Briceno, C.M., A.L. Carrano, B.K. Thorn, and M. Esterman. “A Design Optimization Framework to Estimate Environmental Impact of DesignDecisions in Consumer Products.” Journal of Green Building, 4.2 (2010): 141-150. Print. "  £
Gyles, T., A. Mruthyunjaya, F. Sanchez, J. Valentino, and M. Esterman. “Leveraging ProductionWaste Streams: Enablers of Successful By-Product Exchange — An Exploratory Study.” Proceedings of ‘10: ASME International Design Engineering Technical Conferences and Computers and Informationin Engineering Conferences, August 2010. n.p. Print. "  £