Karl Hirschman Headshot

Karl Hirschman

Professor
Department of Electrical and Microelectronic Engineering
Kate Gleason College of Engineering

585-475-5130
Office Location
Office Mailing Address
82 Lomb Memorial Drive, Rochester, NY 14623

Karl Hirschman

Professor
Department of Electrical and Microelectronic Engineering
Kate Gleason College of Engineering

Education

BS, MS, Rochester Institute of Technology; Ph.D., University of Rochester

Bio

Dr. Karl D. Hirschman a Professor in the Electrical & Microelectronic Engineering Department at the Rochester Institute of Technology. He has also been the faculty director of the Semiconductor & Microsystems Fabrication Laboratory since 2001. Dr. Hirschman received his B.S. in Microelectronic Engineering and the M.S. in Electrical Engineering from Rochesterr Institute of Technology. He received the Ph.D. degree in Electrical Engineering from the University of Rochester. Dr. Hirschman has published over 50 technical papers in refereed journals and conference proceedings. He is an active member in the IEEE, MRS and SID. He has served as an officer of the Rochester IEEE Electron Device Society local chapter for the last fifteen years, and he coordinates the IEEE Annual EDS Activities in Western NY Conference. He teaches courses at RIT in process and device technology ranging from undergraduate freshman to graduate level. His current research activities are in silicon and metal-oxide thin-film electronics. For more about Dr. Hirschman see: http://people.rit.edu/kdhemc/

Currently Teaching

MCEE-201
3 Credits
An introduction to the basics of integrated circuit fabrication. The electronic properties of semiconductor materials and basic device structures are discussed, along with fabrication topics including photolithography diffusion and oxidation, ion implantation, and metallization. The laboratory uses a four-level metal gate PMOS process to fabricate an IC chip and provide experience in device design - and layout (CAD), process design, in-process characterization and device testing. Students will understand the basic interaction between process design, device design and device layout.
MCEE-601
3 Credits
This course introduces the beginning graduate student to the fabrication of solid-state devices and integrated circuits. The course presents an introduction to basic electronic components and devices, lay outs, unit processes common to all IC technologies such as substrate preparation, oxidation, diffusion and ion implantation. The course will focus on basic silicon processing. The students will be introduced to process modeling using a simulation tool such as SUPREM. The lab consists of conducting a basic metal gate PMOS process in the RIT clean room facility to fabricate and test a PMOS integrated circuit test ship. Laboratory work also provides an introduction to basic IC fabrication processes and safety.
MCEE-704
3 Credits
A senior or graduate level course on the application of simulation tools for physical design and verification of the operation of semiconductor devices. The goal of the course is to provide a more in-depth understanding of device physics through the use of simulation tools. Technology CAD tools include Silvaco (Athena/Atlas) for device simulation. The lecture will explore the various models that are used for device simulation, emphasizing the importance of complex interactions and 2-D effects as devices are scaled deep-submicron. Laboratory work involves the simulation of various device structures. Investigations will explore how changes in the device structure can influence device operation.
MTSE-790
1 - 9 Credits
Dissertation research by the candidate for an appropriate topic as arranged between the candidate and the research advisor.

Latest News

Select Scholarship

Published Article
McCabe, Andrew M., Robert G. Manley, J.G. Couillard, C.A. Kosik Williams, and K.D. Hirschman. “High Field Induced Stress Suppression of GIDL Effects in Accumulation-Mode P Channel TFTs.” ECS Transactions, 33.5 (2010): 95-103. Web. † ≠*
Rettmann, Ryan D., J.G. Couillard, and K.D. Hirschman. “Characterization of Silicon-on-GlassSubstrates using Variable Angle Spectroscopic Ellipsometry.” ECSTransactions, 33.5 (2010): 135-142. Web. † ≠*
Formal Presentation
Veeramachaneni, Bharat, J.D. Winans, S. Hu, D. Kawamura, P.M. Fauchet, K. Witt, and K.D. Hirschman. “A Novel Technique for Localized Formationof SOI Active Regions.” Porous Semiconductors - Science and Technology (PSST-2010) 7th International Conference. 14- 19 March 2010. Presentation. †