This course introduces students to the macroscopic and microscopic aspects of different types of welding. Students will experience and learn different welding techniques such as MIG, TIG, Stick, and Oxyacetylene welding. Actual practice with the latest technologies such as MIG and TIG will reinforce concepts and provide practical hands-on experience. Several sample test parts will be welded in a lab and broken with a tensile tester to evaluate the calculated load compared to the welded joint strength. Weld samples will also be microscopically inspected to determine the HAZ (heat affected zone) of the material. Oxyacetylene and plasma cutting will be experienced. Interpreting weld symbols on drawings will be learned and applied. **Possible lab fee associated with this course.**

Students will learn the applications of mechanics through the examination of mechatronic elements and systems. It is broken into two parts: Fundamentals of Mechanics of Materials (a.k.a. Strength of Materials) You will learn to calculate stresses and deflections in members loaded under axial, transverse, and torsional loads. Fundamentals of Dynamics You will learn to use kinematics (study of motion without regard to forces) and kinetics (study of forces required to cause motion, e.g., Newton’s Laws of Motion) to calculate the motion of particles and rigid bodies in motion. You will also gain experience with computational tools, laboratory equipment, experimental methods, teamwork, project management and communications as you complete project assignments.

This course provides the MMSI graduate students an opportunity to complete their degree requirements by addressing a practical real-world challenge using the knowledge and skills acquired throughout their studies. This course is not only the culmination of a student's course work but also an indicator of the student's ability to use diverse knowledge to provide a tangible solution to a problem. The capstone project topic can be in the areas of product development, manufacturing automation, management system, quality management or electronics packaging. The course requires a comprehensive project report and a final presentation.

Continuation of Capstone