Martin K. Anselm
Martin K. Anselm
BS, State University College at Geneseo; MS, Clarkson University; Ph.D., Binghamton University
Dr. Martin K. Anselm (Director of the Center for Electronics Manufacturing, RIT). Dr. Anselm holds an undergraduate degree in Physics, a Masters in Mechanical Engineering and a Ph.D. in Materials Science & Engineering. Dr. Anselm's Industrial experience includes twelve years of electronics failure analysis and root cause analysis. He also managed the Universal Instruments AREA Consortium which conducted research in assembly materials, process and reliability of electronic packaging. Dr. Anselm served on the Board of Directors for the Surface Mount Technology Association (SMTA) from 2013-2019.
Dr. Anselm's Ph.D. in Materials Science and Engineering from Binghamton University dissertation was titled, "(Cu,Ni)6Sn5 Intermetallic Formation Kinetics on Electroless Nickel (Ni) When Varying Copper (Cu) Concentration and Reflow Process.” His current second level electronics packaging research foci include; 1. Advanced Manufacturing for electronic miniaturization, 2. Low Temperature lead-free solder alloy process optimization and reliability, 3. Solder joint microstructural evolution in thermomechanical fatigue. Dr. Anselm also supports Photonic Integrated Circuit (PIC) packaging and reliability studies funded through NYS and the DOD. Beyond this academic research, Dr. Anselm has also developed training courses for unemployed and under-employed veterans in the NYS Finger Lakes district. He has secured funding from New York’s Consolidated Funding Application (CFA) to provide veterans with training and certifications in electronics manufacturing. This work has resulted in gainful employment for many veterans in the local electronics manufacturing industry.
In the News
July 14, 2020
Zooming with German university to talk cars and automotive technology
A study abroad experience for RIT’s College of Engineering Technology (CET) students took place over Zoom when the class connected with peers from Hochschule Mittweida University of Applied Sciences in central Germany.
February 28, 2020
New surface mount technology equipment added to RIT’s Center for Electronics Manufacturing and Assembly
RIT recently received new electronics assembly equipment for its Center for Electronics and Manufacturing Assembly (CEMA). The university installed a DEK NeoHorizen printing machine, used by electronics manufacturers to precisely place transistors onto electronic circuit boards.
February 27, 2020
Center for Electronics Manufacturing and Assembly receives automated optical inspection equipment
RIT recently installed a MIRTEC MV3 OMNI automated, optical inspection machine in its Center for Electronics Manufacturing and Assembly (CEMA). The equipment enables researchers and manufacturers to better inspect transistors that must be methodically aligned on printed circuit boards used in electronic devices such as smart phones, game consoles and computer systems.