RIT Hosting Annual Microelectronic Engineering Conference

Rochester Institute of Technology’s microelectronic engineering department in the Kate Gleason College of Engineering hosts its 22nd annual Microelectronic Engineering Conference May 11 and 12. The conference will feature presentations by experts from the semiconductor industry and RIT microelectronic engineering faculty and students. A tour of RIT’s Semiconductor and Microsystems Fabrication Laboratory will also be offered.

Highlighting the conference will be talks by Pary Baluswamy of Micron Technology Inc., discussing “Lithography from the Trenches,” and Charles Cheng of AmberWave Systems Corp., speaking on “Strained Silicon Technology: Materials and Devices.”

RIT industrial affiliates that will be represented include Eastman Kodak Co., IBM Corp., Intel Corp., Motorola Inc., Texas Instruments Inc., Xerox Corp. and others. The conference will be in Xerox Auditorium in the James E. Gleason Building. An opening reception and dinner will be held at 6 p.m. on May 10 at the RIT Inn & Conference Center, 5257 West Henrietta Road.

Note: For more information, visit http://www.microe.rit.edu/22

RIT’s Kate Gleason College of Engineering is among the nation’s top-ranked engineering colleges. The college offers undergraduate and graduate degrees in applied statistics, engineering science, and computer, electrical, industrial and systems, mechanical, and microelectronic engineering and a doctoral degree in microsystems engineering. RIT was the first university to offer undergraduate degrees in microelectronic and software engineering.