Microelectronics Manufacturing Engineering Master of engineering degree
Microelectronics Manufacturing Engineering
Master of engineering degree
Overview
Develop a knowledge of chemistry, physics, and engineering to better understand integrated circuit technology in microelectronics manufacturing.
The microelectronics manufacturing engineering masters covers the intensive aspects of integrated circuit technology, modeling and simulation techniques, and hands-on laboratory verification of these processes. In the laboratory, students from various engineering and science backgrounds design and fabricate semiconductor circuits, learn how to utilize imaging equipment, develop and create systems, and manufacture and test their own integrated circuits in our cleanroom. Microelectronics manufacturing at RIT utilizes many different disciplines such as chemistry, physics, and engineering to provide a degree that makes our students very sought after in the job market.
The ME in microelectronics manufacturing engineering provides a broad-based education for students who are interested in a career in the semiconductor industry and hold a bachelor’s degree in traditional engineering or other science disciplines.
Program outcomes
After completing the program, students will be able to:
- Design and understand a sequence of processing steps to fabricate a solid state device to meet a set of geometric, electrical, and/or processing parameters.
- Analyze experimental electrical data from a solid state device to extract performance parameters for comparison to modeling parameters used in the device design.
- Understand current lithographic materials, processes, and systems to meet imaging and/or device patterning requirements.
- Understand the relevance of a process or device, either proposed or existing, to current manufacturing practices.
- Perform in a microelectronic engineering environment, as evidenced by an internship.
- Appreciate the areas of specialty in the field of microelectronics, such as device engineering, circuit design, lithography, materials and processes, and yield and manufacturing.
Plan of study
Students are awarded the ME degree after the successful completion of 30 credit hours, which are comprised of core courses, elective courses, research seminars, and an internship. Under certain circumstances, a student may be required to complete bridge courses totaling more than the minimum number of credits. Students complete courses in microelectronics, microlithography, and manufacturing.
Microelectronics
Microelectronics courses cover major aspects of integrated circuit manufacturing technology such as oxidation, diffusion, ion implantation, chemical vapor deposition, metallization, plasma etching, etc. These courses emphasize modeling and simulation techniques as well as hands-on laboratory verification of these processes. Students use special software tools for these processes. In the laboratory students design and fabricate silicon MOS integrated circuits. They learn how to utilize most of the semiconductor processing equipment and how to develop and create a process, manufacture and test their own integrated circuits.
Microlithography
The microlithography courses are advanced courses in the chemistry, physics and processing involved in microlithography. Optical lithography will be studied through diffraction, Fourier and image assessment techniques. Scalar diffraction models will be utilized to simulate aerial image formation and influences of imaging parameters. Positive and negative resist systems, as well as processes for IC application, will be studied. Advanced topics will include chemically amplified resists; multiple layer resist systems; phase shift masks, and electron beam, x-ray and deep UV lithography. Laboratory exercises include projection system design, resist materials characterization, process optimization, electron beam lithography and excimer laser lithography.
Manufacturing
The manufacturing course include topics such as scheduling, work-in-progress tracking, costing, inventory control, capital budgeting, productivity measures and personnel management. Concepts of quality and statistical process control are introduced to the students. The laboratory for this course is the student-run factory functioning in the department. Important issues that include measurement of yield, defect density, wafer mapping, control charts and other manufacturing measurement tools are introduced to the students in the lecture and laboratory. Computer integrated manufacturing is also studied in detail. Process modeling, simulation, direct control, computer networking, database systems, linking application programs, facility monitoring, expert systems applications for diagnosis and training and robotics are all introduced and supported by laboratory experiences in the integrated circuit factory at RIT. An online version of the ME in microelectronic manufacturing engineering is available for engineers employed in the semiconductor industry.
Internship
The program requires students to complete an internship. This requirement provides a structured and supervised work experience that enables students to gain job-related skills that assist them in achieving their desired career goals.
Students with prior engineering-related job experience may submit a request for credit by experience with the department head. Supported by a letter from the appropriate authority substantiating the student’s job responsibility, duration, and performance quality, a student may be able to waive the internship if a previous work experience fulfills this requirement.
For students who are not working in the semiconductor industry while enrolled in this program, the internship can be completed at RIT. It involves an investigation or study of a subject or process directly related to microelectronic engineering under the supervision of a faculty advisor. An internship may be taken any time after the completion of the first semester, and may be designed in a number of ways. At the conclusion of the internship, submission of a final internship report to the faculty advisor and program director is required.
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Curriculum
Microelectronic Manufacturing Engineering, ME degree, typical course sequence
| Course | Sem. Cr. Hrs. | |
|---|---|---|
| First Year | ||
| MCEE-601 |
Microelectronic Fabrication
This course introduces the beginning graduate student to the fabrication of solid-state devices and integrated circuits. The course presents an introduction to basic electronic components and devices, lay outs, unit processes common to all IC technologies such as substrate preparation, oxidation, diffusion and ion implantation. The course will focus on basic silicon processing. The students will be introduced to process modeling using a simulation tool such as SUPREM. The lab consists of conducting a basic metal gate PMOS process in the RIT clean room facility to fabricate and test a PMOS integrated circuit test ship. Laboratory work also provides an introduction to basic IC fabrication processes and safety.
|
3 |
| MCEE-605 |
Lithography Materials and Processes
Microlithography Materials and Processes covers the chemical aspects of microlithography and resist processes. Fundamentals of polymer technology will be addressed and the chemistry of various resist platforms including novolac, styrene, and acrylate systems will be covered. Double patterning materials will also be studied. Topics include the principles of photoresist materials, including polymer synthesis, photochemistry, processing technologies and methods of process optimization. Also advanced lithographic techniques and materials, including multi-layer techniques for BARC, double patterning, TARC, and next generation materials and processes are applied to optical lithography. Graduate paper required.
|
3 |
| MCEE-603 |
Thin Films
This course focuses on the deposition and etching of thin films of conductive and insulating materials for IC fabrication. A thorough overview of vacuum technology is presented to familiarize the student with the challenges of creating and operating in a controlled environment. Physical and Chemical Vapor Deposition (PVD & CVD) are discussed as methods of film deposition. Plasma etching and Chemical Mechanical Planarization (CMP) are studied as methods for selective removal of materials. Applications of these fundamental thin film processes to IC manufacturing are presented. Graduate paper required.
|
3 |
| MCEE-732 |
Microelectronics Manufacturing
This course focuses on CMOS manufacturing. Topics include CMOS process technology, work in progress tracking, CMOS calculations, process technology, long channel and short channel MOSFET, isolation technologies, back-end processing and packaging. Associated is a lab for on-campus section (01) and a graduate paper/case study for distance learning section (90). The laboratory for this course is the student-run factory. Topics include Lot tracking, query processing, data collection, lot history, cycle time, turns, CPK and statistical process control, measuring factory performance, factory modeling and scheduling, cycle time management, cost of ownership, defect reduction and yield enhancement, reliability, process modeling and RIT's advanced CMOS process. Silicon wafers are processed through an entire CMOS process and tested. Students design unit processes and integrate them into a complete process. Students evaluate the process steps with calculations, simulations and lot history, and test completed devices.
|
3 |
| MCEE-602 |
Semiconductor Process Integration
This is an advanced level course in Integrated Circuit Devices and process technology. A detailed study of processing modules in modern semiconductor fabrication sequences will be done through simulation. Device engineering challenges such as shallow-junction formation, fin FETs, ultra-thin gate dielectrics, and replacement metal gates are covered. Particular emphasis will be placed on non-equilibrium effects. Silvaco Athena and Atlas will be used extensively for process simulation. Graduate paper required.
|
3 |
| MCEE-615 |
Nanolithography Systems
An advanced course covering the physical aspects of micro- and nano-lithography. Image formation in projection and proximity systems are studied. Makes use of optical concepts as applied to lithographic systems. Fresnel diffraction, Fraunhofer diffraction, and Fourier optics are utilized to understand diffraction-limited imaging processes and optimization. Topics include illumination, lens parameters, image assessment, resolution, phase-shift masking, and resist interactions as well as non-optical systems such as EUV, maskless, e-beam, and nanoimprint. Lithographic systems are designed and optimized through use of modeling and simulation packages. Graduate paper required.
|
3 |
| MCEE-795 |
Microelectronics Research Methods
Weekly seminar series intended to present the state of the art in microelectronics research. Other research-related topics will be presented such as library search techniques, contemporary issues, ethics, patent considerations, small business opportunities, technical writing, technical reviews, effective presentations, etc.
|
2 |
| MCEE-777 |
Master of Engineering Internship or Graduate Elective
This course number is used to fulfill the internship requirement for the master of engineering degree program. The student must obtain the approval of the department head before registering for this course.
|
3 |
| Second Year | ||
| Choose one of the following: | 1 |
|
| MCEE-795 |
Microelectronics Research Methods
Weekly seminar series intended to present the state of the art in microelectronics research. Other research-related topics will be presented such as library search techniques, contemporary issues, ethics, patent considerations, small business opportunities, technical writing, technical reviews, effective presentations, etc.
|
|
1 credit of Independent Study |
||
Graduate Electives |
6 | |
| Total Semester Credit Hours | 30 |
|
Admission Requirements
To be considered for admission to the ME program in microelectronic manufacturing engineering, candidates must fulfill the following requirements:
- Complete a graduate application.
- Hold a baccalaureate degree (or equivalent) from an accredited university or college in engineering or a related field.
- Submit official transcripts (in English) from all previously completed undergraduate and graduate course work.
- Have a minimum cumulative GPA of 3.0 (or equivalent).
- Submit two letters of recommendation from academic or professional sources.
- International applicants whose native language is not English must submit scores from the TOEFL, IELTS, or PTE. A minimum TOEFL score of 79 (internet-based) is required. A minimum IELTS score of 6.5 is required. The English language test score requirement is waived for native speakers of English or for those submitting transcripts from degrees earned at American institutions.
- Candidates applying with a bachelor’s degree in non-electrical or non-microelectronic engineering fields may be considered for admission, however they may be required to complete additional bridge courses to ensure they are adequately prepared for graduate study.
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