Martin K. Anselm Headshot

Martin K. Anselm

Assistant Professor
Department of Manufacturing and Mechanical Engineering Technology
College of Engineering Technology

585-475-2005
Office Location

Martin K. Anselm

Assistant Professor
Department of Manufacturing and Mechanical Engineering Technology
College of Engineering Technology

Education

BS, State University College at Geneseo; MS, Clarkson University; Ph.D., Binghamton University

Bio

Dr. Martin K. Anselm (Director of the Center for Electronics Manufacturing, RIT).  Martin holds an undergraduate degree in Physics, a Masters in Mechanical engineering and a PhD in Materials Science & Engineering.  With more than twelve years of industrial experience at Universal Instruments in electronics failure analysis and root cause analysis, he was the manager of the AREA Consortium where he was responsible for managing research in assembly materials, process and reliability of electronic packaging. At RIT his research interests include solder joint reliability and advanced manufacturing process development for electronic assemblies. Since 2013, Martin has served on the Board of Directors for the Surface Mount Technology Association (SMTA) and chairs their Training Committee.

585-475-2005

Currently Teaching

ENGT-510
0 Credits
This faculty directed undergraduate research experience involves student(s) in a research project. Under the guidance of CET faculty and using one or a variety of methods, students will collect data and contribute to problem solving within a research environment. As an undergraduate research experience, emphasis is on the process of scientific research, including problem definition, formulating a research plan, data collection/analysis and interpretation based on existing research. Department permission is required.
ENGT-518
1 - 4 Credits
Students will travel to a foreign country and learn about various aspects of engineering within the context of local customs, culture, and economy. Students will attend presentations and explore facilities that represent engineering disciplines in global locations. Details of the specific experience will vary and will be announced by the specific department. Students may receive credit only once per topic title.
MFET-656
3 Credits
The advanced course in semiconductor packaging will provide a thorough coverage of the materials, processes, failure, and reliability of chip level packaging. Specific topics include single-chip, multi-chip, wafer level and 3D stacked packaging, photonic integrated chip (PIC), smaller passives and embedded passive component technology, advanced substrates and microvia technology, solder technologies, metallurgy and joint formation, thermal management, thermal and mechanical behavior of packaging, failure analysis, and reliability testing. Course includes projects and literature review in topics of semiconductor packaging. This course is cross listed with MFET-556 students may receive credit for MFET-556 or MFET-656, not both.
MFET-788
3 Credits
Students will rigorously develop their thesis research ideas, conduct literature reviews, identify and plan methodologies, prepare schedules, and gain a clear understanding of the expectations of the faculty and the discipline. Each student will be required to prepare a committee approved thesis research proposal and may begin work on their thesis.
MFET-797
3 Credits
This course provides the MMSI graduate students an opportunity to complete their degree requirements by addressing a practical real-world challenge using the knowledge and skills acquired throughout their studies. This course is not only the culmination of a student's course work but also an indicator of the student's ability to use diverse knowledge to provide a tangible solution to a problem. The capstone project topic can be in the areas of product development, manufacturing automation, management system, quality management or electronics packaging. The course requires a comprehensive project report and a final presentation.
MFET-790
3 Credits
The MMSI thesis is based on thorough literature review and experimental substantiation of a problem, by the candidate, in an appropriate topic. A written proposal has to be defended and authorized by the faculty adviser/committee. The proposal defense is followed by experimental work, a formal written thesis, and oral presentation of findings. The candidate should have completed the requisite courses for the program before enrolling for the thesis.
MFET-556
3 Credits
The advanced course in semiconductor packaging will provide a thorough coverage of the materials, processes, failure, and reliability of chip level packaging. Specific topics include single-chip, multi-chip, wafer level and 3D stacked packaging, photonic integrated chip (PIC), smaller passives and embedded passive component technology, advanced substrates and microvia technology, solder technologies, metallurgy and joint formation, thermal management, thermal and mechanical behavior of packaging, failure analysis, and reliability testing. This course is cross listed with MFET-656 students may receive credit for MFET-556 or MFET-656, not both.
MFET-345
2 Credits
Course provides a thorough understanding of the technology, components, equipment, and manufacturing process for through hole technology and surface mount technology electronics manufacturing. Students will develop a strong foundation needed for advanced work in surface mount technology (SMT).
MFET-655
3 Credits
This course provides a thorough understanding of the technology, components, equipment, design and manufacturing process for surface mount electronics manufacturing. Students will develop a strong foundation needed for advanced work in surface mount technology (SMT). The laboratory activities will provide the students an orientation and familiarization of the manufacturing equipment and process parameters for printed circuit board assembly.
MFET-798
0 Credits
Continuation of Capstone

Select Scholarship

Journal Editor
Yeritsyan, Hrant, ed. Journal of Electronic Materials. New York: Springer, 2018. Web.
Ramkumar, Dr. Manian, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print.
Pan, Jianbiao, ed. IEEE Transactions on Components, Packaging and Manufacturing Technology. New York: IEEE, 2017. Print.
Park, Seungbae, ed. ASME Journal of Electronic Packaging. New York: ASME, 2017. Web.
Arfaei, Dr. Babak, ed. JOM Special Issue. USA: n.p., 2016. Print.
Byko, Maureen, ed. The Journal of The Minerals, Metals & Materials Society (TMS). Warrendale, PA: he Minerals, Metals & Materials Society, 2015. Print.
Published Conference Proceedings
Murling, Adam, et al. "Practical Implementation of Assembly Processes for Low-Melting Point Solder Pastes." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web.
Gomez, Priscilla, Tayler Swanson, and Martin K. Anselm. "A Study on The Minimum and Maximum Temperatures of The Reflow Process in SMT Assembly on Paste Containing Bismuth Alloys Combined with Lead-Free Solder Spheres." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web.
Bastardo, Keyla Y., Tayler Swanson, and Martin K. Anselm. "Experimental Study on The Capability And Performance of A Jet Dispensing Feeder in Components Fastening." Proceedings of the SMTAi. Ed. Richard Coyle. Eden Prairie, MN: SMTA, Web.
Thomas, Shalomin, Keyla Y. Bastardo, and Martin K. Anselm. "Industry Trends in Photonics Packaging: Passive Fiber and Die Coupling." Proceedings of the Pan Pacific. Ed. Phil Isaacs. Kaui, Hawaii: SMTA, 2017. Web.
Valooran, Rohit and Martin K. Anselm. "Investigation of the Factors Influencing the Performance of Low Temperature Solder." Proceedings of the SMTAi 2017. Ed. Raiyo Aspandiar. Rosemont, IL: SMTA, 2017. Web.
Anselm, Martin K. and Reza Ghaffarian. "QFN Reliability, Thermal Shock, Lead-free vs. SnPb, Microstructure." Proceedings of the 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). Ed. Unknown. Orlando, FL: IEEE, 2017. Web.
Palaniappan, Sakthi Cibi Kannammal and Dr. Martin K. Anselm. "A STUDY ON PROCESS, STRENGTH AND MICROSTRUCTURE ANALYSIS OF LOW TEMPERATURE SnBi CONTAINING SOLDER PASTES MIXED WITH." Proceedings of the SMTAi September 2016. Ed. SMTAi. Rosemont, Illinois: SMTAi, 2016. Web.
Anselm, Dr. Martin K. "Failure Analysis: Lessons Learned." Proceedings of the Hybrid SMT. Ed. Hybrid SMT. Nurnberg, Barvaria, Germany: n.p., 2016. Web.
Anselm, Dr. Martin K. "Failure Analysis: Lessons Learned." Proceedings of the SMTAi. Ed. SMTAi. Rosemont, Illinois: SMTAi, 2016. Web.
Anselm, Martin Karl. "A.R.E.A. Component Warpage: Issues with Measurement and Standardization." Proceedings of the SMTA, September 29- October 2, Chicago IL. Ed. SMTA. Edina, MN 55424: n.p., 2014. Web.
Journal Paper
Su, Quang T., et al. "Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking." ASME Journal of Electronic Packaging 140. 041004-1 (2018): 9. Web.
Sriperumbudur, Sai Srinivas, Dr. Martin K. Anselm, and Michael Meilunas. "Solder Paste Volume Effects on Assembly Yield and Reliability for Bottom Terminated Components." Soldering & Surface Mount Technology. (2016): 1-16. Print.
Invited Keynote/Presentation
Anselm, Martin K. "WIT at RIT” - Women in Technology & Is Photonics Integration in our Future?" SMTAi. SMTA. Chicago, IL. 15 Oct. 2018. Conference Presentation.
Anselm, Martin K. "Integrated Photonics Packaging Reliability — Assessing Packaging Strategies and Reliability Testing." International Integrated Reliability Workshop. IEEE. Fallen Leaf Lake, CA. 8 Oct. 2017. Conference Presentation.