Researchers Develop Lead-Free Electronics Packaging Solution
RIT investigates new adhesive to enhance environmental quality and performance
A team of faculty from Rochester Institute of Technology is investigating a unique conductive adhesive for lead-free electronics assembly that will improve product quality and reduce the environmental footprint of the manufacturing process.
Lead by engineers at RIT’s Center for Electronics Manufacturing and Assembly the multidisciplinary team will investigate the use of an anisotropic conductive adhesive, a lead-free conductive material, for soldering electronics to circuit boards. The material also allows for reduced energy use because it can be processed at lower temperatures and enhances the long-term performance of circuit assemblies.
“Anisotropic adhesive has significant environmental and performance advantages but is still in the early stages of development and usage in commercial manufacturing processes,” says Manian Ramkumar, the director of the Center for Electronics Manufacturing and Assembly. “This project will allow for additional testing of the material to improve overall performance and enhance additional commercialization and use.”
The project is being funded through the New York State Pollution Prevention Institute, a statewide research and development center housed at RIT. It focuses on developing and implementing new pollution prevention, alternative material and sustainable design technologies in New York state businesses through direct technical assistance and targeted grants.
“The Pollution Prevention Institute is very pleased to be funding this project given the Center for Electronics Manufacturing and Assembley’s long history of applied research and technical expertise in the electronics industry,” adds Anahita Williamson, director of the institute. “The advancement of lead-free adhesives will have a tremendous impact on the environment and further promote the efficiency and productivity of New York state industry.”
Ramkumar will be joined on the research project by RIT’s Changfeng Ge, assistant professor of manufacturing and mechanical engineering technology/packaging science, and K.S.V. Santhanam, professor of materials science and engineering.
June 18, 2019
Students combine hardware and attacking skills at cybersecurity competition
A team of RIT students from different computing disciplines came together last semester to place third in the 2019 MITRE Collegiate eCTF (embedded capture-the-flag) cybersecurity competition.
June 18, 2019
A 'Ghost Galaxy' May Have Given the Milky Way Its Signature Swirl
Though direct observational evidence of Antlia 2 was not obtained until last year, one scientist has had a decade-long hunch that it was there. Sukanya Chakrabarti, an astrophysicist at RIT predicted in 2009 that an object packed with dark matter was causing tidal effects at the edge of the Milky Way.
June 14, 2019
Scientists detected signs of our Milky Way colliding with another 'ghost' galaxy
Antlia 2, the "ghost of a galaxy" orbiting the Milky Way, is a dark horse in more ways than one. Not only is it so faint it was only just discovered last year, it may now be responsible for curious ripples in the hydrogen gas that makes up the Milky Way's outer disc.
June 12, 2019
New evidence shows crash with Antlia 2 gave the Milky Way the ripples in its outer disc
The newly-discovered dark dwarf galaxy Antlia 2’s collision with the Milky Way may be responsible for our galaxy’s characteristic ripples in its outer disc, according to a study led by Assistant Professor Sukanya Chakrabarti. The Antlia 2 dwarf galaxy was discovered from the second data release of the European Space Agency’s Gaia mission, which aims to chart a three-dimensional map of our galaxy.